Organic electroluminescent element, production method of the same, display device, and lighting device

ABSTRACT

An organic electroluminescent element comprising a laminated body incorporating an anode substrate, an anode, at least one non-light emitting organic layer A exhibiting positive hole transportability, at least one light emitting organic layer B, at least one non-light emitting organic layer C exhibiting electron transportability, a cathode, and a cathode substrate in the sequence set forth, wherein at least 80% by weight of the organic layer A and the organic layer C in the laminated body is formed via a wet process, and the laminated body is made with an adhesion process between the organic layer A and the organic layer B, or between the organic layer B and the organic layer C.

This application is the United States national phase application ofInternational Application PCT/JP2006/307105 filed Apr. 4, 2006.

TECHNICAL FIELD

The present invention relates to an organic electroluminescent element,a production method of the same, a display device, and a lightingdevice, and in more detail, to an organic electroluminescent elementexhibiting high efficiency at low cost, a production method of the same,a display device, and a lighting device.

BACKGROUND

In recent years, the use of organic electroluminescent (EL) elements hasbeen investigated in display devices such as a flat display and lightsources in electrophotographic copiers and printers.

The above organic EL elements are electric current driving type lightemitting elements in which a very thin film of fluorescent organiccompounds is sandwiched between an anode and a cathode, and light isemitted due to flow of the electric current. Generally, organicmaterials are insulators, but it is possible to inject an electriccurrent when the thickness of the organic layer is markedly decreased,whereby it is possible to drive it as an organic EL element. Further, ata low voltage of at most 10 V, it is possibly to achieve driving. Due tothat, it is possible to realize highly efficient light emission, wherebyattention has been paid as a future display.

Specifically, S. R. Forrest et al. have recently discovered aphosphorescence emitting organic EL element utilizing an excited tripletstate, realizing an efficiency, which significantly exceeds that ofconventional organic EL element utilizing a singlet state (Appl. Phys.Lett. (1999), 75(1), 4-6). Further, as reported by Adachi et al. (J.Appl. Phys., 90, 5048 (2001)), luminous efficiency reached even 60 lm/Wand the resulting element is expected to be applicable not only todisplay but also for applications as lighting sources.

When lighting devices employing an organic EL elements are produced, itis essential to consider the following aspects.

At present, organic EL materials are of low molecular weight based typesand also polymer based types. Production of organic EL elementsemploying low molecular weight materials are carried out via evaporationunder high vacuum. Low molecular weight materials are easily purifieddue to capability of sublimation purification, whereby it is possible toemploy highly pure organic EL materials. Further, since it is easy torealize a laminated layer structure, whereby excellent efficiency andshelf life are realized.

However, since vapor deposition is carried out under high vacuum of atmost 10⁻⁴ Pa, operation becomes complex, resulting in an increase incost, whereby preference is not always realized in terms of production.Specifically, for lighting applications, it is essential to form anorganic EL element of a large area, whereby vapor deposition becomes adifficult production process. Further, in regard to a phosphorescentdopant which is employed in phosphorescence emitting organic ELelements, it is difficult to introduce, to an organic EL element, aplurality of uniform dopants of a large area via vapor deposition.Consequently, in terms of cost and technology, such process is currentlyconsidered to be very difficult.

Contrary to the above, in regard to polymer based materials, for theirproduction, it is possible to employ wet processes such as spin coatingor ink-jet printing. Namely, since it is possible to carry outproduction under atmospheric pressure, advantages result in which costis lowered. Further, since a thin film is produced employing apreviously prepared solution, features result in which dopants areeasily regulated and non-uniformity tend to not result even in a largearea. It may be stated that the above features are very advantageous inthe aspect of cost and production technologies for lighting use oforganic EL elements.

However, when the wet process is employed in the polymer basedmaterials, it is difficult to realize a laminated layer structure. Whena second layer is laminated onto a first layer, the polymer materialsare dissolved in solvents of the second layer to result in blending ofthe first and second layers. Due to that, compared to production ofelements employing low molecular weight materials, production efficiencyis commonly degraded.

Polymer based organic EL elements are commonly produced via a spincoating method, an ink-jet method or printing.

The spin coating method is only applicable to sheets, making itimpossible to achieve continuous production. The ink-jet method is veryuseful for production of the display via a three-color light emittingsystem, but is not preferable, in terms of productivity, for productionof light emitting devices such as displays for lighting or via a colorexchange system, in which one side is subjected to light emission of thesame color.

Consequently, production employing a printing method, has been proposed(refer, for example, to Patent Documents 1-3). The printing method is auseful film forming method due to its high simplicity and is a method offorming layers one by one. Consequently, if formation of a multi-layeredstructure is demanded, it is necessary that after making one layer, thefollowing layer be formed. Due to that, productivity is low, andfurther, the apparatus is large and the number of processes increase,whereby the resulting cost increases. Further, when polymers, which aresoluble in organic solvents, are laminated, a problem occurs in whichtwo adjacent layers are blended.

-   Patent Document 1: Japanese Patent Publication Open to Public    Inspection (hereinafter referred to as JP-A) No. 3-269995-   Patent Document 2: JP-A No. 10-77467-   Patent Document 3: JP-A No. 11-273859

DISCLOSURE OF THE INVENTION Problems to be Solved by the Invention

An object of the present invention is to provide an organic EL elementexhibiting high light emitting “efficiency”, a highly efficientproduction method of an organic EL element of employing a wet process, adisplay device, and a lighting device.

Means to Solve the Problems

The above object of the present invention was achieved employing thefollowing embodiments.

1. In an organic electroluminescent element composed of a laminated bodyincorporating an anode substrate, an anode, at least one non-lightemitting organic layer A exhibiting positive hole transportability, atleast one light emitting organic layer B, at least one non-lightemitting organic layer C exhibiting electron transportability, acathode, and a cathode substrate in the stated order, an organicelectroluminescent element wherein in the aforesaid laminated body, atleast 80% by weight of the organic layer constituting aforesaid organiclayer A and aforesaid organic layer C is formed via a wet process, andan adhesion structure between aforesaid organic layer A and aforesaidorganic layer B, or between aforesaid organic layer B and aforesaidorganic layer C is formed.2. The organic electroluminescent element, described in 1. above,wherein aforesaid organic layer B is formed via a transfer method.3. The organic electroluminescent element, described in 1. or 2. above,wherein the aforesaid anode substrate or cathode substrate is composedof flexible materials.4. In a production method of an organic electroluminescent elementcomposed of a laminated body incorporating an anode substrate, an anode,at least one non-light emitting organic layer A exhibiting positive holetransportability, at least one light emitting organic layer B, at leastone non-light emitting organic layer C exhibiting electrontransportability, a cathode, and a cathode substrate in the statedorder, a production method of an organic electroluminescent element,composed of: (a-1) a process which laminates, on an anode substrate, apartially laminated body incorporating the aforesaid anode substrate,anode, and organic layer A in the stated order; (a-2) a process whichlaminates, on the cathode substrate, a partially laminated bodyincorporating the aforesaid cathode substrate, cathode and organic layerC; (a-3) a process in which aforesaid organic layer B is formed on atemporary support; (b) a process in which aforesaid organic layer B istransferred onto the organic layer side of the partially laminated bodyon the aforesaid anode substrate or the partially laminated body on thecathode substrate by facing and laminating the organic layer B side ofthe partially laminated body on the aforesaid anode substrate or thepartially laminated body on the cathode substrate with organic layer Bside on the aforesaid temporary support, followed by at least a heattreatment or a pressure treatment; (c) a process which forms a laminatedbody by facing the organic layer B side of the substrate to whichaforesaid organic layer B has been transferred with the organic layerside of the partially laminated body on another substrate to whichaforesaid organic layer B has not been transferred, followed by at leasta heat treatment or a pressure treatment; and (d) a process in which theentire periphery of the side of the aforesaid laminated body is sealedvia an adhesive.5. The production method of an organic electroluminescent element,described in 4. above, incorporating a process in which at least oneorganic layer B formed on the aforesaid temporary support incorporates aprocess in which B, G, and R three-color light emitting pixels aresubjected to patterning.6. An organic electroluminescent element, wherein production is achievedemploying the production method of an organic electroluminescent elementdescribed in 4. or 5. above.7. The organic electroluminescent element, described in any one of 1.-3.and 6., wherein light emission is due to phosphorescence.8. A display device incorporating the organic electroluminescent elementdescribed in any one of 1.-3., 6., and 7. above.9. A lighting device incorporating the organic electroluminescentelement described in any one of 1.-3., 6., and 7. above.

Effects of the Invention

The present invention enables to provide an organic EL elementexhibiting high light emission luminance, a production method of anorganic EL element resulting in high production efficiency by employinga wet process, a display device and a lighting device.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a sectional view showing one example of the layerconfiguration of the organic EL element of the present invention.

FIG. 2 is a sectional view showing another example of the layerconfiguration of the organic EL element of the present invention.

FIG. 3 is a sectional view showing yet another example of the layerconfiguration of the organic EL element of the present invention.

FIG. 4 is a sectional view showing one more example of the layerconfiguration of the organic EL element of the present invention.

FIG. 5 is a sectional view showing a further example of the layerconfiguration of the organic EL element of the present invention.

FIG. 6 is a sectional view showing yet one more example of the layerconfiguration of the organic EL element of the present invention.

FIG. 7 is one example showing a process of the production method of thepatterning member employed in the present invention.

FIG. 8 is a structural view (declined line arrangement) of a mask.

FIG. 9 is a structural view (declined line arrangement) of a pressingplate.

FIG. 10 is a schematic view showing a flow of the primary transferprocess.

FIG. 11 is a structural view of a transfer sheet after completion oftransfer from the primary transfer sheet.

FIG. 12 is a structural view (a stripe arrangement) of the mask for acathode.

FIG. 13 shows the cathode substrate after deposition of cathode Al andan electron injecting layer.

FIG. 14 is a structural view (a stripe arrangement) of a mask for theanode.

FIG. 15 shows an anode substrate after deposition of anode ITO.

FIG. 16 is a structural view (stripe arrangement) of the primarytransfer sheet.

FIG. 17 is a structural view of the transfer sheet after completion oftransfer from the primary transfer sheet for blue.

FIG. 18 is a structural view of the transfer sheet after transfer fromtwo types of primary transfer sheets for blue and green.

FIG. 19 is a structural view of the transfer sheet after transfer fromthree types of the primary transfer sheets for blue, green, and red.

FIG. 20 is a structural view of the first laminated body aftercompletion of transfer to a cathode substrate from the transfer sheet.

FIG. 21 is a structural view of the organic EL element after adhesion ofthe first laminated body to the anode substrate.

FIG. 22 is a structural view (stripe arrangement) of the mask fortransferring a light emitting layer.

FIG. 23 is a structural view (stripe arrangement) of the pressing platefor transferring a light emitting layer.

FIG. 24 is a structural view (stripe arrangement) of the mask fortransferring a light emitting layer.

FIG. 25 is a constitutional view (stripe arrangement) of the pressingplate for transferring a light emitting layer.

FIG. 26 is a structural view of the transfer sheet after completion oftransfer from the primary transfer sheet for blue.

FIG. 27 is a structural view of the transfer sheet after completion oftransfer from two types of primary transfer sheets for blue and green.

FIG. 28 is a structural view of the transfer sheet after completion oftransfer from three types of primary transfer sheets for blue, green,and red.

FIG. 29 is a structural view of the primary laminated body aftercompletion of transfer to the cathode substrate from the transfer sheet.

FIG. 30 is a structural view of the organic EL element after adhesion ofthe first laminated body to the anode substrate.

DESCRIPTION OF DESIGNATIONS

-   1 anode substrate-   2 anode-   3 non-light emitting organic layer exhibiting positive hole    transportability-   4 light emitting organic layer-   5 non-light emitting organic layer exhibiting electron    transportability-   6 cathode-   7 cathode substrate-   8 anode lead-   9 cathode lead-   10 adhesive agent layer-   11 moisture and oxygen absorbing layer-   101 coating apparatus (coating means)-   101A applicator roller-   101B metering roller-   102 primary transfer sheet-   103 pressing plate-   103A projection of pressing plate-   104 drying apparatus (drying means)-   105 transfer apparatus (transfer means)-   106 transfer zone-   107 substrate supporting base-   110 transfer sheet-   120 feeding roller-   130 winding roller-   M mask-   MA aperture section-   P pattern material

BEST MODE FOR CARRYING OUT THE INVENTION

By structuring the organic electroluminescent element of the presentinvention, as specified by any one of claims 1-3, claim 6, and claim 7,it was possible to provide an organic EL element exhibiting highluminance “efficiency”, a production method of an organic EL elementresulting in high production efficiency by employing a wet process, adisplay device and a lighting device.

Further, the inventors of the present invention conducted diligentinvestigations and achieved the present invention by discovering that itwas possible to prepare an organic EL element composed of a multilayerat low cost when the constituting layer of the organic EL element wasdivided into a plurality of sections, each of which was prepared via amethod in which primarily a wet process was mainly employed andintegration was carried out via transfer and adhesion of each of thesections.

Further, the inventors of the present invention achieved the presentinvention by discovering that it was possible to produce a highperformance organic EL element while increasing productivity via anincrease in the degree of parallel of production processes by setting adivision position between the non-light emitting organic layerexhibiting positive hole transportability and the light emitting organiclayer, and between the light emitting organic layer and the non-lightemitting organic layer exhibiting electron transportability when thestructural layer of the organic EL element was divided into a pluralityof sections.

Still further, the inventors of the present invention achieved thepresent invention by discovering that it was possible to prepare a highperformance organic EL element while enhancing productivity due to anincrease in the process yield in such a manner that when the structurallayer of the organic EL element was prepared via division to a pluralityof sections, at least one substrate was employed as one composed offlexible materials, whereby it was possible to retard formation ofdefects of the adhesion plane when the structural layer of the organicEL element was adhered.

Still further, the inventors of the present invention achieved thepresent invention by discovering that it was possible to prepare a highperformance organic EL element while enhancing productivity due to anincrease in the process yield in such a manner that when the structurallayer of the organic EL element was prepared via division to a pluralityof parts, and subsequently, integration was carried out via transfer andadhesion, during the initial transfer, the resulting structural layerand the light emitting layer were adhered onto a substrate, composed offlexible materials, whereby it is possible to reduce formation ofdefects on the adhesion plane.

The present invention will now be detailed.

(Layer Configuration)

A laminated body structuring the organic EL element of the presentinvention has a layer configuration composed of at least an anodesubstrate and an anode, a non-light emitting organic layer Aincorporating at least one layer exhibiting positive holetransportability, organic layer B incorporating at least one layerexhibiting light emission, non-light emitting organic layer Cincorporating at least one layer exhibiting electron transportability, acathode, and a cathode substrate. Other than these, it is preferable toincorporate a moisture absorption layer and/or an oxygen absorptionlayer (hereinafter referred to as a moisture-oxygen absorption layer).It is preferable that non-light emitting organic layer A, whichincorporates at least one layer exhibiting positive holetransportability, further incorporates a positive hole injecting layerand an electron blocking layer in addition to at least one positive holetransporting layer. It is preferable that non-light emitting organiclayer C, which incorporates at least one layer exhibiting electrontransportability, incorporates an electron injecting layer and apositive hole blocking layer in addition to at least one electrontransporting layer. When the moisture-oxygen absorption layer isincorporated, the preferable layer configuration is: anodesubstrate/anode/organic layer/cathode/moisture-oxygen absorptionlayer/cathode substrate.

Preferable specific examples of the layer configuration of the organicEL element of the present invention are shown below; however, thepresent invention is not limited thereto.

(1) anode/positive hole transporting layer/electron transporting typelight emitting layer/electron transporting layer/cathode

(2) anode/positive hole transporting layer/positive hole transportingtype light emitting layer/electron transporting layer/cathode

(3) anode/positive hole injecting layer/electron transporting type lightemitting layer/electron transporting layer/cathode

(4) anode/positive hole injecting layer/positive hole transporting typelight emitting layer/electron transporting layer/cathode

(5) anode/positive hole injecting layer/positive hole transportinglayer/electron transporting type light emitting layer/electrontransporting layer/cathode

(6) anode/positive hole injecting layer/positive hole transportinglayer/positive hole transporting type light emitting layer/electrontransporting layer/cathode

(7) anode/positive hole transporting layer/electron transporting typelight emitting layer/electron transporting layer/electron injectinglayer/cathode

(8) anode/positive hole transporting layer/positive hole transportingtype light emitting layer/electron transporting layer/electron injectinglayer/cathode

(9) anode/positive hole injecting layer/positive hole transportinglayer/electron transporting type light emitting layer/electrontransporting layer/electron injecting layer/cathode

(10) anode/positive hole injection layer/positive hole transportinglayer/positive hole transporting type light emitting layer/electrontransporting layer/electron injecting layer/cathode

Each of FIGS. 1-6 is a sectional view showing one example of the layerconfiguration of the organic EL element of the present invention.

In FIGS. 1-6, numeral 1 represents an anode substrate, 2 represents ananode, 3 represents a non-light emitting organic layer exhibitingpositive hole transportability, 4 represents a light emitting organiclayer, 5 represents a non-light emitting organic layer exhibitingelectron transportability, 6 represents a cathode, 7 represents acathode substrate, 8 represents an anode lead, 9 represents a cathodelead, 10 represents an adhesive layer, and 11 represents amoisture-oxygen absorbing layer.

FIG. 1 shows an example in which anode substrate 1 and cathode substrate7 are of the same size, both of which are adhered without any shifting.The adhesion positions are between non-light emitting organic layer 3exhibiting positive hole transportability and light emitting organiclayer 4, as well as between light emitting organic layer 4 and non-lightemitting organic layer 5 exhibiting electron transportability. Adhesivelayer 10 covers the periphery of anode substrate 1, anode 2, non-lightemitting organic layer 3 exhibiting positive hole transportability,light emitting organic layer 4, non-light emitting organic layer 5exhibiting electron transportability, cathode 6, and cathode substrate7.

FIG. 2 shows an example in which anode substrate 1 and cathode substrate7 are larger than anode 2 and cathode 6, respectively, and adhesion iscarried out by shifting anode substrate 1 and cathode substrate 7. Theadhesion positions may be the same as the examples shown in FIG. 1.Adhesive layer 10 covers the entire periphery of anode 2, non-lightemitting organic layer 3 exhibiting positive hole transportability,light emitting organic layer 4, non-light emitting organic layer 5exhibiting electron transportability, and cathode 6, and further coversthe side of anode substrate 1 along the side of anode 2 and the side ofcathode substrate 7 along with cathode 6.

FIG. 3 shows an example in which anode substrate 7, which is in the samesize as cathode 6, is adhered to anode substrate 1 which is larger thananode 2. The adhesion position may be the same as the example shown inFIG. 1. Adhesive layer 10 covers the entire periphery of anode 2,non-light emitting organic layer 3 exhibiting positive holetransportability, light emitting organic layer 4, non-light omittingorganic layer exhibiting electrons transportability, cathode 6, andcathode substrate 7.

FIG. 4 shows the constitution in which a moisture-oxygen absorbing layeris further added to the constitution of FIG. 1.

FIG. 5 shows the constitution in which a moisture-oxygen absorbing layeris further added to the constitution of FIG. 2.

FIG. 6 shows the constitution in which a moisture-oxygen absorbing layeris further added to the constitution of FIG. 3.

(Production Method)

The production method of the organic EL element of the present inventionincludes processes: (a-1) layer formation of an anode and at least onenon-light emitting organic layer exhibiting electron transportability onan anode substrate, (a-2) layer formation of a cathode and at least onenon-light emitting organic layer exhibiting electron transportability ona cathode substrate, and (a-3) layer formation of at least one lightemitting organic layer on a temporary support, (b) transfer of the abovelight emitting layer to the organic layer on the above anode or cathodesubstrate in such a manner that the organic layer on the anode orcathode substrate is faced and overlapped with the light emitting layerand followed by at least one of a heating process or a pressing process,(c) after adhesion of mutual organic layers in such a manner that theorganic layer on the anode or cathode substrate, which was not subjectedto transfer of the light emitting layer is faced and overlapped with thelight emitting layer, followed by at least one of a heating process anda pressing process, and (d) sealing the side of the resulting laminatedbody employing adhesives.

By employing an adhesion method, advantages are realized in which noextra sealing space is formed in the adhered interface to enhancedurability and in addition, it is possible to efficiently prepareorganic EL elements of a large area at lower cost. Adhesion methodsinclude those in which adhesion is carried out via close contact,pressure adhesion, and fusion of the interface between two layers.During adhesion, it is preferable to apply heating and/orpressurization. Heating and pressurization may be carried outindividually or in combination.

Usable heating means include common methods such as use of a laminator,an infrared heater, a roller heater, a heater, laser, or thermal head.When large area adhesion is performed, planar heating means are morepreferred, which include laminators, infrared heaters, and rollerheaters. Adhesion temperature is not particularly limited, which isvariable depending on materials of organic layers and heating members.It is preferably 40-250° C., is more preferably 50-200° C., but is mostpreferably 60-280° C. However, the adhesion temperature relates toheating members, materials, and heat resistance of substrates, wherebyit varies depending on enhancement of the heat resistance.

Pressurization means are not particularly limited. However, whensubstrates such as glass are employed, which are easily destroyed due todistortion, preferred are those which result in uniform pressurization.For example, it is preferable to employ a pair of rollers one of whichis a rubber roller, or both of which are rubber rollers. Specifically,it is possible to employ laminators (for example, FAST LAMINATORVA-400III, produced by Taisei Laminator Co., Ltd.) and thermal heads forthermal transfer printing.

(Adhesive Agents)

Adhesive agents employed in the organic EL elements of the presentinvention are not particularly limited, and usable examples includeultraviolet radiation curable resins, heat curable resins, double liquidtype curable resins, moisture curable resins, anaerobic curable resins,hot-melt type resins. Of these, preferred are epoxy based adhesiveagents which exhibit minimal moisture permeability and minimal oxygenpermeability, and any of these which are of the ultraviolet radiationcurable type, the heat curable and the double liquid curable type arepreferred. Further, in view of the decrease in the number of processesand easiness, ultraviolet radiation curable types are preferred.

Coating methods of adhesive agents are not particularly limited, but thedispense method is preferably employed. The coated amount of adhesiveagents is not particularly limited. When ultraviolet radiation curabletype adhesive agents are employed, coating may be carried out so thatthe resulting film thickness is sufficient to absorb ultravioletradiation. Further, when the double liquid mixing type is employed, itsamount is not particularly limited as long as two liquids aresufficiently blended. In order to assure durability of organic ELelements, thickness D (refer to FIG. 1) of adhesive agents is preferably0.1-5 mm.

Adhesive agents are applied onto the entire periphery of the side of alaminated body. Entire periphery of the side, as described herein,refers to the entire side of the laminated body composed of an anodesubstrate, an anode, an organic layer, a cathode, and a cathodesubstrate when the entire edge results in a uniform plane, as shown inFig. (a). On the other hand, as shown in FIGS. 2( b) and 3, when theanode substrate or the cathode substrate is larger, it refers to theentire side of the laminated body excluding the larger substrate(s).

(Materials of Each Layer)

Materials which constitute each of the layers of the organic EL elementof the present invention will now be detailed.

(a) Anode Substrate

Specific examples of the anode substrates employed in the presentinvention include inorganic materials such as zirconia-stabilizedyttrium (YSZ) or glass, as well as organic materials such as polyestersincluding polyethylene terephthalate, polybutylene terephthalate,polyethylene naphthalate, and polystyrene, polycarbonate, polyethersulfone, polyallylate, polyimide, polycycloolefin, norbornene resins,poly(chlorotrifluoroethylene), or polyimide. It is preferable thatemployed organic materials exhibit excellent heat resistance,dimensional stability, solvent resistance, electrical insulation, andmachinability.

Shapes, structures, and sizes of the anode substrate are notparticularly limited. They may be appropriately selected based on theirapplication and purposes. Commonly, the above shape is plate-like. Theabove structure may be of a single layer or a laminated layer. Further,the above substrate may be composed of a single material or at least twomaterials.

An anode substrate may be transparent and colorless or opaque. It ispossible to provide a moisture permeation inhibiting layer (being a gasbarrier layer) on the surface or rear surface (being on the anode side)of the anode substrate. Suitably employed as materials of the abovemoisture permeation inhibiting layer (being the gas barrier layer) areinorganic compounds such as silicon nitride or silicon oxide. It ispossible to form the above moisture permeation inhibiting layer (beingthe gas barrier layer) employing methods such as a high frequencysputtering method.

If desired, a hard-coat layer and an under-coat layer may further beapplied onto the anode substrate. The thermal linear expansioncoefficient of the anode substrate is preferably at most 20 ppm/° C. Thethermal linear expansion coefficient is determined by the method inwhich a sample is heated at a constant rate and the resulting variationof length is recorded, and determined mainly by the TMA method. When thethermal linear expansion coefficient exceeds 20 ppm/° C., during theadhesion process and use, electrodes and organic layers peel off due toheat, resulting in degradation of durability.

The water vapor permeability of the anode substrate, determined based onmethod of JIS K 7129-1992, is commonly at most 0.1 g/(m²·24 hours)(25±0.5° C., and relative humidity (90±2) %), is preferably at most 0.05g/(m²·24 hours), is more preferably at most 0.01 g/(m²·24 hours), but ismost preferably at most 1×10⁻³ g/(m²·24 hours).

Further, oxygen permeability determined based on the method of JIS K7126-1987 is commonly at most 0.1 ml/(m²·24 hours·MPa), is preferably atmost 0.05 ml/(m²·24 hours·MPa), is more preferably at most 0.01ml/(m²·24 hours·MPa), but is most preferably at most 1×10⁻³ ml/(m²·24hours·MPa).

By achieving the above regulation, it is possible to minimizepenetration, into the interior of the organic EL element, of moistureand oxygen which result in degradation of durability.

(b) Anode

The above anode is commonly usable when it exhibits a function whichsupplies positive holes to the organic layer. The shapes, structures,and sizes are not particularly limited. Further, they may beappropriately selected based on the use and application of organic ELs.

Examples of suitable materials of the above anode include metals,alloys, metal oxides, electrically conductive organic compounds, andmixtures thereof. Materials which exhibit a work function of at least4.0 eV are preferred. Specific examples include semiconductive metaloxides such as tin oxide (ATO and FTO) doped with antimony and fluorine,tin oxide, zinc oxide, indium oxide, indium tin oxide (ITO), zinc indiumoxide (IZO); metals such as gold, silver, chromium, or nickel; mixturesor laminated materials of those metals with electrically conductivemetal oxides; electrically conductive inorganic compounds such as copperiodide or copper sulfide; dispersions of the above semiconductive metaloxides or metal compounds, electrically conductive organic materialssuch as polyaniline, polythiophene, or polypyrrole, and laminatedmaterials of these with ITO.

It is possible to form the above anode on a substrate or an organiclayer, employing the method selected from chemical systems such as avacuum deposition method, a sputtering method or an ion plating methodupon considering suitability for the above materials.

Incidentally, the above anode patterning may undergo chemical etchingsuch as photolithography or physical etching employing lasers. Further,a mask is overlapped and subsequently, vacuum deposition or sputteringmay be carried out or a lift-off method or a printing method may also becarried out.

It is appropriately to select the thickness of the above anode,depending on the above materials, and it is not possible to specify it.However, the above thickness is commonly 10-50 μm, but is preferably50-20 μm. The resistance value of the above anode is preferably at most10⁶Ω/□, but is more preferably at most 10⁵Ω/□•• When the value is atmost 10⁵Ω/□, it is possible to prepare a large area organic EL elementof high performance via arranging the bus line electrode of the presentinvention. The above anode is colorless and transparent, or colored andtransparent. In order to receive emitting light from the above anodeside, transmittance is preferably at least 60%, but is more preferablyat least 70%. It is possible to determine the above transmittance,employing the methods know in the art in which a spectrophotometer isemployed.

(c) Cathode Substrate

Specific examples of the cathode substrate employed in the presentinvention include inorganic materials such as zirconia stabilizedyttrium YSZ) or glass and organic materials such as polyesters andpolyethylene naphthalate including polyethylene phthalate, polybutylenephthalate, as well as polystyrene, polycarbonate, polyethersulfone,polyallylate, polyimide, polycycloolefin, norbornene resins,poly(chlorotrifluoroethylene), and polyimide. In the case of organicmaterials, it is preferable that they exhibit excellent heat resistance,dimensional stability, solvent resistance, electrical insulation, andmachinability.

Shapes, structures, and sizes of anode substrates are not particularlylimited. They may be appropriately selected based on their use andpurpose of organic EL elements. Commonly, the above shape is plate-like.The above structure may be of a single layer structure or a laminatedlayer structure. Further, the above substrate may be composed of asingle material or at least two materials.

The cathode substrate may be transparent and colorless or opaque. Whenthe cathode substrate is opaque, a substrate support is preferred inwhich an insulation layer is provided on one side or both sides of themetal foil. Metal foils are not particularly limited, and usable foilsinclude an aluminum foil, a copper foil, a stainless steel foil, a goldfoil, and a silver foil. Of these, in view of ease of machining andcost, the aluminum foil or copper foil is preferred. Insulation layersare not particularly limited, and may be formed employing inorganiccompounds such as an inorganic oxide or an inorganic nitride, polyesterssuch as polyethylene terephthalate, polybutylene phthalate, orpolyethylene naphthalate, and plastics such as polystyrene,polycarbonate, polyether sulfone, polyacrylate, allyldiglycol carbonate,polyimide, polycyloolefin, norbornene resins,poly(chlorotrifluoroethylene), or polyimide.

The thermal linear expansion coefficient of the cathode substrate ispreferably at most 20 ppm/° C. The thermal linear expansion coefficientis determined by the method in which a sample is heated at a constantrate and the resulting variation of length is recorded, and determinedmainly by the TMA method. When the thermal linear expansion coefficientexceeds 20 ppm/° C., during a adhesion process and their use, electrodesand organic layers peel off due to heat, resulting in degradation ofdurability.

The thermal linear expansion coefficient of an insulation layer providedon the cathode substrate is preferably at most 20 ppm/° C. Preferredmaterials to form the insulation layer of at most 20 ppm/° C. includemetal oxide such as silicon oxide, germanium oxide, zinc oxide, aluminumoxide, titanium oxide, or copper oxide, and metal nitrides such assilicone nitride, germanium nitride, or aluminum nitride. They may beemployed individually or in combinations of at least two. The thicknessof the organic insulation layer composed of metal oxide and/or metalnitride is preferably 10-1,000 nm. When the thickness of inorganicinsulation layer is at most 10 nm, insulation capability becomes toolow, while the thickness of the insulation layer is at least 1,000 nm,cracks tend to be formed followed by formation of pin holes anddegradation of insulation. Methods to form an insulation layer composedof metal oxides and/or metal nitrides are not limited, and as the abovemethods, it is possible to utilize dry system methods such as a vapordeposition method, a sputtering method, a CVC method, wet system methodssuch as a sol-gel method, or methods in which metal oxide particlesand/or metal nitride particles are dispersed into solvents and theresulting dispersion is coated.

As plastic materials of a thermal linear expansion coefficient of atmost 20 ppm, it is possible to most preferably employ polyimide orliquid crystal polymers. Quality of these plastic materials is detailedin “Plastic Data Book” (edited by “Plastic” Editing Department of AsahiKasei Amidas Corp.). When polyimide is employed as an insulation layer,it is preferable that a sheet composed of polyimide is laminated with analuminum foil. The thickness of the sheet composed of polyimide ispreferably 10-200 μm. When the thickness of the sheet composed ofpolyimide is at most 10 μm, during lamination, ease of handling isdegraded. On the other hand, when the thickness of the sheet composed ofpolyimide is at least 200 μm, flexibility is lost to degrade the ease ofhandling. The insulation layer may be provided on one side or both sidesof the metal foil. When provided on both sides, both sides may becomposed of metal oxides and/or metal nitrides, or both sides may be aplastic insulation layer such as polyimide. Further, One side may be aninsulation layer composed of metal oxides and/or metal nitrides, and theother may be an insulation layer composed of polyimide. If furtherdesired, a hard-coat layer and an under-coat layer may be arranged.

Water vapor permeability (25±0.5° C., relative humidity (90±2)%) of thecathode substrate, determined by the method based on JIS K 7129-1992 iscommonly 0.1 g/(m²·24 hours), is preferably at most 0.05 g/(m²·24hours), is more preferably 0.01 g/(m²·24 hours), but is most preferably1×10⁻³ g/(m²·24 hours).

Oxygen permeability of the cathode substrate, determined by the methodbased on JIS K 7126-1987 is commonly 0.1 ml/(m²·24 hours·MPa), ispreferably at most 0.05 ml/(m²·24 hours·MPa), is more preferably 0.01ml/(m²·24 hours·MPa), but is most preferably 1×10⁻³ ml/(m²·24hours·MPa).

By regulating as above, it becomes possible to minimize permeation ofwater vapor and oxygen which result in degradation of durability of theinterior of organic El elements. As such materials, it is possible toemploy the same materials described above.

(d) Cathode

Shapes, structures, and sizes of cathodes are not particularly limitedas long as they function as a cathode which injects electrons into theabove organic layer. Accordingly, it is possible to select them fromelectrodes known in the art, depending on their use and purpose.

Examples of preferred materials of the above cathode include metals,alloys, metal oxides, electrically conductive materials, and themixtures thereof. Those of a work function of at most 4.5 eV arepreferred. Specific examples include alkaline metals (for example, Li,Na, K, and Cs), alkaline earth metals (for example, Mg and Ca), gold,silver, lead, aluminum, sodium, sodium-potassium alloy, lithium-aluminumalloy, magnesium-silver alloy, and rare earth metals such as indium orytterbium. These may be employed singly, but may be employed incombination of at least two types in view of realizing stability and ofmaking electron injecting properties compatible.

Of these, in terms of electron injecting properties, alkaline metals andalkaline earth metals are preferred. In view of excellent retentionstability, materials which incorporate aluminum as a main component arepreferred. “Materials which incorporate aluminum as a main component”,as described herein, refer to aluminum itself, aluminum alloys, andmixtures (for example, lithium-aluminum alloy, or magnesium-aluminumalloy) incorporating alkali metals or alkaline earth metals in an amountof 0.01-10% by weight.

The above materials of cathodes are detailed in Japanese PatentPublication No. 2-15595 and JP-A No. 5-121172.

Methods to form the above cathode are not particularly limited, and inthe present invention, the formation is carried out in equipment undervacuum. It is possible to form the cathode on the above substrate,employing the method such as a physical system including a vacuumdeposition method, and a sputtering method, or a chemical systemincluding CVD and a plasma CVD method, which is appropriately selectedupon considering adaptability with the above materials. For example,when metals are selected as a cathode material, one type or at least twotypes may be employed simultaneously or sequentially via the sputteringmethod.

Meanwhile, the above cathode patterning may undergo chemical etchingsuch as photolithography or physical etching employing lasers. Further,a mask is overlapped and subsequently, vacuum deposition or sputteringmay be carried out or a lift-off method or a printing method may also becarried out.

Further, a dielectric layer at a thickness of 0.1-5 nm, composed ofabove alkali metals or above alkali earth metals may be inserted betweenthe above cathode and the above organic layer. Meanwhile, it is possibleto form the above dielectric layer, employing any of the methods such asa vacuum deposition method, a sputtering method, or an ion platingmethod.

It is not possible to definitely specify the thickness of the abovecathode since it may be suitably selected depending on the materials.However, the above thickness is commonly 10 nm-5 μm, but is preferably50 nm-1 μm.

(e) Organic Layer

In the present invention, the above organic layer is composed of atleast one non-light emitting organic layer exhibiting positive holetransportability, at least one light emitting organic layer, and atleast one non-light emitting layer exhibiting electron transportability.In this specification of the present invention, term “dielectric” refersto the compound itself and derivatives thereof.

(1) Light Emitting Layer

A light emitting layer employed in the present invention is composed ofat least one type of a light emitting material, and if desired, mayincorporate positive hole transporting materials, electron transportingmaterials, and host materials.

The light emitting layer is composed of a mixture of host materials anddopants. “Host” and “dopant” in the light emitting layer refers to thefollowing. The light emitting layer is composed of at least two types ofcompounds, and in the above two types of compounds, the compound of ahigher mixing ratio (by weight) is a host, while the compound of a lowermixing ratio is a dopant.

The mixing ratio of the dopant is preferably 0.001-50% by weight, whilethe mixing ratio of the host is preferably 50-100% by weight.

Two principles are listed. One principle is an energy transfer type inwhich that the excited state of a host compound is formed viarecombination on a host to which hosts are transported and the resultingenergy is transferred to dopants, followed by light emission from thedopants. The other is a carrier trap type in which dopants trap carriersand recombination of carriers occurs on the dopant compound, followed bylight emission from the dopants. In either case, a condition is that theenergy of the excited state of dopant compounds is lower than that ofthe excited state of host compounds.

Further, in the energy transfer type, a preferred condition, in whichenergy transfer is easily conducted, is a larger overlap integral oflight emission of the hosts and absorption of the dopants. In thecarrier trap type, a necessary relationship is that carrier trappingeasily occurs. For example, in carrier trapping of electrons, it isnecessary that the level of electron affinity (LUMO) of the dopant ishigher than that of the host. On the other hand, in carrier trapping ofcarriers, it is necessary that ionization potential (being HOMO level)of the dopant is lower than that of the dopant.

Based on the above, it is possible to select dopant compounds as adopant, considering luminescent color including color purity and lightemission efficiency, while dopant compounds are selected from thosewhich result in desired carrier transportability and satisfy the aboveenergy relationship.

Light emitting dopants employed in the present invention are notparticularly limited and those are employable which are fluorescenceemitting compounds or phosphorescence emitting compounds. Examples offluorescence emitting compounds include benzoxazole derivatives,benzimidazole derivatives, benzothiazole derivatives, styrylbenzenederivatives, polyphenyl derivatives, diphenylbutadiene derivatives,tetraphenylbutadiene derivatives, naphthalimide derivatives, coumarinderivatives, perylene derivatives, perinone derivatives, oxadiazolederivatives, aldazine derivatives, pyralidine derivatives,cyclopentadiene derivatives, bisstyrylanthracene derivatives,quinacridone derivatives, pyrrolopyridine derivatives, thiadiazopyridinederivatives, styrylamine derivatives, aromatic dimethylidenederivatives, various metal complexes represented by metal complexes andrare earth complexes of 8-quinolynol derivatives, and polymer compoundssuch as polythiophene derivatives, polyphenylene derivatives,polyphenylenevinylene derivatives, or polyfluorene derivatives. Thesemay be employed individually or in combinations of at least two types.

Phosphorescence emitting compounds are not particularly limited, butorthometal metal complexes or porphyrin metal complexes are preferred.Orthometal metal complexes, as described herein, include all compoundsdescribed, for example, in Akio Yamamoto, “Yuki Kinzoku Kagaku-Kiso toOyo-(Organic Metal Chemistry-Base and Application-” pages 150 and 232,Shokabo Sha (published in 1982), and H. Yersin, “Photochemistry andPhotophysics of Coordination Compounds” pages 71-77, 135-146,Springer-Verlag Co. (published in 1987). The above organic layerincorporating the above orthometal metal complexes is advantageous dueto realization of high luminance and excellent light emissionefficiency.

Various ligands, which form the above orthometal metal complexes, areavailable and are described in the above references. Of these, the mostpreferable ligands include 2-phenylpyrindien derivatives,7,8-banzoquinoline derivatives, 2-(2-thienyl)pyridine derivatives,2-(1-naphthyl)pyridine derivatives, and 2-phenylquinoline derivatives.If desired, these derivatives may have substituents. The aboveorthometal metal complexes may have other ligands other than the aboveligands.

It is possible to synthesize orthometal metal complexes employed in thepresent invention via various methods known in the art such as Inorg.Chem. 1991, No. 30, page 1,685, ibid. 1988, No. 27, page 3,469, ibid.1994, No. 33, page 545, Inorg. Chim. Acta 1991, No. 181, page 245, J.Organomet. 1987, No. 335, page 293, or J. Am. Chem. Soc. 1985, No. 107,page 1,431. Of the above orthometal complexes, in the present invention,in view of enhancement of the light emitting efficiency, it is possibleto preferably employ compounds which emit light from a triplet stateexcimer. Further, of porphyrin metal complexes, preferred are porphyrinplatinum complexes. The above phosphorescence emitting compounds may beemployed individually or in combinations of at least two types. Further,the above fluorescence emitting compounds and phosphorescence emittingcompounds may be simultaneously employed. In the present invention, inview of luminance of emitted light and light emitting efficiency, it ispreferable to employ the above phosphorescence emitting compounds.

As the above positive hole transporting materials, it is possible toemploy any of the low molecular weight positive hole transportingmaterials and polymer positive hole transporting materials. They are notlimited as long as they exhibit any of the functions which injectpositive holes from the anode, transport positive holes, and blockelectrons injected from the cathode. Examples of such materials includecarbazole derivatives, triazole derivatives, oxazole derivatives,oxadiazole derivatives, imidazole derivatives, polyarylalkanederivatives, pyrazoline derivatives, pyrazolone derivatives,phenylenediamine derivatives, arylamine derivatives, amino-substitutedchalcone derivatives, styrylanthracene derivatives, fluorenonederivatives, hydrazone derivatives, stilbene derivatives, silazanederivatives, aromatic tertiary amine compounds, styrylamine compounds,aromatic dimethylydene based compounds, porphyrin based compounds, aswell as polymer compounds such as polysilane based compounds,poly(N-vinylcarbazole) derivatives, aniline based copolymer, thiopheneoligomer, electrically conductive polymer oligomer such aspolythiophene, polythiophene derivatives, polyphenylene derivatives,polyphenylenevinylene derivatives, or polyfluorene derivatives. They maybe employed individually or in combinations of at least two types.

The content of the above positive hole transporting materials in theabove light emitting layer is preferably 0-99.9% by weight, but is morepreferably 0-80% by weight.

The above electron transporting materials are not limited as long asthey exhibit any of the functions which transport electrons, and blockpositive holes injected from the anode. Examples of such materialsinclude triazole derivatives, oxazole derivatives, oxadiazolederivatives, fluorenone derivatives, anthraquinodimethane derivatives,anthrone derivatives, diphenylquinone derivatives, thiopyrandioxidederivatives, carbodiimide derivatives, fluorenylidenemethanederivatives, distyrylpyrazine derivatives, heterocyclic tetracarboxylanhydrides, phthalocyanine derivatives, various metal complexesrepresented by metal complexes of 8-quinolyl derivatives and metalphthalocyanine, metal complexes having, as a ligand, benzoxazole, orbenzothiazole, aniline based copolymer, electrically conductive polymeroligomers such as polythiophene, and polymer compounds such aspolythiophene derivatives, polyphenylene derivatives, polyphenylenederivatives, or polyfluorene derivatives.

The content of the above electron transporting materials in the abovelight emitting layer is preferably 0-99.9% by weight, but is morepreferably 0-80% by weight.

The above host compounds refer to those which allow compounds capable ofemitting fluorescence or phosphorescence to emit luminescence so thatenergy transfer occurs from the excited state of the host compound tocompounds capable of emitting fluorescence or phosphorescence. The abovehost materials are not particularly limited as long as they are capableof achieving transfer of excitation energy to light emitting materials,and may be appropriately selected depending on their use. Specificallylisted are carbazole derivatives, triazole derivatives, oxazolederivatives, oxadiazole derivatives, imidazole derivatives,polyarylalkane derivatives, pyrazoline derivatives, pyrazolonederivatives, phenylenediamine derivatives, arylamine derivatives,amino-substituted chalcone derivatives, styrylanthracene derivatives,fluorenone derivatives, hydrazone derivatives, stilbene derivatives,silazane derivatives, aromatic tertiary amine compounds, styrylaminecompounds, aromatic dimethylidene based compounds, porphyrin basedcompounds, anthaquinodimethane derivatives, anthrone derivatives,diphenylquinone derivatives, thiopyrandioxide derivatives, carbodiimidederivatives, fluorenylidenemethane derivatives, distyrylpyrazinederivatives, heterocyclic tetracarboxylic anhydrides such asnaphthaleneperylene, phthalocyanine derivatives, various metal complexesrepresented by metal complexes of 8-quinolyl derivatives and metalcomplexes in which metal phthalocyanine, benzoxazole, or benzothiazoleis employed as a ligand, polysilane based compounds,poly(N-vinylcarbazole) derivatives, aniline based copolymers,electrically conductive polymer oligomers such as thiophene oligomer orpolythiophene, and polymer compounds such as polythiophene derivatives,polyphenylene derivatives, or polyfluorene derivatives.

Preferred as host materials are compounds which exhibit positive holetransportability and electron transportability, minimize an increase inwavelength of emitted light and further exhibit relatively high Tg(glass transition temperature).

It is possible to prepare such compounds in such a way that the πelectron plane is modified to a non-plane, utilizing effects such assteric hindrance. For example, a substituent which results in sterichindrance is introduced into the ortho position (viewed from thenitrogen atom) of the aryl group of triarylamine, whereby the twistangle increases. Namely, by effectively arranging, in an organiccompound, steric hindrance-resulting substituents such as a methylgroup, a t-butyl group, an isopropyl group, or a peri position hydrogenatom of a naphthyl group, it is possible to prepare a light emittingmaterial which emits short wavelength light without lowering the Tg ofpositive hole transporting materials exhibiting a relatively high Tg andelectron transporting materials exhibiting a relatively high Tg, eventhough the resulting positive hole transportability and electrontransportability are slightly degraded. In this regard, substituents arenot limited thereof.

Further, when a group, which is conjugated to the aromatic ring, isintroduced, it is also possible to prepare the above compounds viaintroduction to a non-conjugated position (for example, in the case oftriphenylamine, the meta-position of the phenyl group).

The above host compounds may be employed individually or in combinationsof at least two types. The content of the above host compounds in theabove light emitting layer is preferably 0-99.9% by weight, but is morepreferable 0-99.0% by weight.

Specifically, in the present invention, if desired, as other components,employed may be electrically inactive polymer binders in the lightemitting layer. Listed as electrically inactive polymers employed, whenneeded, may, for example, be polyvinyl chloride, polycarbonate,polystyrene, polymethyl methacrylate, polybutyl methacrylate, polyester,polysulfone, polyphenylene oxide, polybutadiene, hydrocarbon resins,ketone resins, phenoxy resins, polyamide, ethyl cellulose, vinylacetate, ABS resins, polyurethane, melamine resins, unsaturatedpolyester, alkyd resins, epoxy resins, silicone resins, polyvinylbutyral, and polyvinyl acetal. When the above light emitting layerincorporates the above polymer binders, advantages result in which it iseasily to form the above light emitting layer of a large area via a wetsystem film forming method and the degree of lamination is improved.

(2) Injection Layer (Buffer Layer)

When needed, injection layers are provided, which include an electroninjecting layer and a positive hole injection layer. As noted above, maybe arranged between the anode and the light emitting or positive holetransporting layer, or between the cathode and the light emitting layeror electron transporting layer.

The injection layer, as described herein, refers to the layer providedbetween the electrode and the organic layer to lower driving voltage andto enhance light emission efficiency, and is detailed in Chapter 2“Denkyoku Zairyo (Electrode Materials) (pages 123-166)” of Second Partof “Yuuki EL Soshi to Sono Kogyoka Saizensen (Organic El Elements andFrontier of Their Industrialization)” (published by NTS Co. Nov. 30,1998), and includes a positive hole injection layer (being an anodebuffer layer) and an electron injecting layer (being a cathode bufferlayer).

The anode buffer layer (being the positive hole injection layer) isdetailed in JP-A Nos. 9-45479, 9-260062, and 8-1288069. Specificexamples include a phthalocyanine buffer layer represented by copperphthalocyanine, an oxide buffer layer represented by vanadium oxide, anamorphous carbon buffer layer, and a polymer buffer layer employingelectrically conductive polymers such as polyaniline (emraldine) orpolythiophene.

The cathode buffer layer (being the electron injecting layer) isdetailed in JP-A Nos. 6-325871, 9-17574, and 10-74586. Specific examplesinclude a metal buffer layer represented by strontium and aluminum, analkaline metal compound buffer layer represented by lithium fluoride, analkaline earth metal compound buffer layer represented by magnesiumfluoride, and an oxide buffer represented by aluminum oxide.

It is preferable that the above buffer layer (the injection layer) is avery thin film. The thickness is preferably in the range of 0.1-100 nmthough varied depending on components.

(3) Blocking Layer

As noted above, if needed, the blocking layer is provided other than thebasic structuring layer composed of a thin organic compound film. Itsexamples include the positive hole blocking (hole blocking) layerdescribed in JP-A No. 11-204359, and “Yuuki EL Soshi to Sono KogyokaSaizensen (Organic El Elements and Frontier)”, N T S Co. Nov. 30, 1998).

In a broad sense, the positive hole blocking layer refers to theelectron transporting layer, which is composed of materials capable oftransporting elections while exhibiting minimal capability to transportpositive holes. By transporting electrons while blocking positive holes,it is possible to enhance the recombination probability of electrons andpositive holes.

On the other hand, in a broad sense, the electron blocking layer refersto the positive hole transporting layer which is composed of materialscapable of transporting positive holes while exhibiting minimalcapability to transport electrons. By transporting positive holes whileblocking electrons, it is possible to enhance the recombinationprobability of electrons and positive holes.

(4) Positive Hole Transporting Layer

The positive hole transporting layer, as described herein, is composedof materials which exhibit a function to transport positive holes. In abroad sense, the positive hole injecting layer as well as the electronblocking layer is included in the positive hole transporting layer.

The positive hole transporting layer may be prepared employing a singlelayer or a plurality of layers. Positive hole transporting materials arenot particularly limited, and it is possible to employ any of thematerials which are selected from those commonly used as chargeinjection transporting materials of positive holes and those, known inthe art, which are used in the positive hole injecting layer and thepositive hole transporting layer of EL elements.

Positive hole transporting materials exhibit any of the injection ortransportation of positive holes and blocking of electrons, and may beeither organic materials or inorganic materials. Examples thereofinclude triazole derivatives, oxadiazole derivatives, pyrazolonederivatives, phenylenediamine derivatives, arylamine derivatives,amino-substituted chalcone derivatives, oxazole derivatives,styrylanthracene derivatives, fluorenone derivatives, hydrazonederivatives, stilbene derivatives, silazane derivatives, aniline basedcopolymer, and electrically conductive polymer oligomer, particularlythiophene oligomer.

The above materials may be employed as positive hole transportingmaterials, but it is preferable to employ porphyrin compounds, aromatictertiary amine compounds, and styrylamine compounds. Of these, it isparticularly preferable to employ the aromatic tertiary amine compounds.

Representative examples of the aromatic tertiary amine compounds includeN,N,N′,N′-tetraphenyl-4,4′-diaminophenyl;N,N′-diphenyl-N,N′-bis(3-methylphenyl)-[1,1′-biphenyl]-4,4′-diamine(TPD); 2,2-bis(4-di-p-tolylaminophenol)propane;1,1-bis(4-di-p-tolylaminophenyl)cyclohexane;N,N,N′,N′-tetra-p-tolyl-4,4′-diaminobiphenyl;1,1-bis(4-p-tolylaminophenyl)-4-phenylcyclohexane,bis(4-dimethylamino-2-methylphenyl)phenylmethane,bis(4-di-p-tolylaminophenyl)phenylmethane,N,N′-diphenyl-N,N′-di(4-methoxyphenyl)-4,4′-diaminobiphenyl,N,N,N′,N′-tetraphenyl-4,4′-diaminodiphenyl ether,4,4′-bios(diphenylamino)quo-triphenyl, N,N,N-tri(p-tolyl)amine,4-(di-p-tolylamino)-4′-[4-(di-p-tolylamino)styryl]stilbene,4-N,N-diphenylamino-(2-diphenylvinyl)benzene,3-methoxy-4′-N,N-diphenylaminostyl benzene, and N-phenylcarbazole. Inaddition, listed are those having two condensed aromatic rings in themolecule, such as 4,4′-bis[N-(1-naphthyl)-N-phenylamino]biphenyl (NPD),described in U.S. Pat. Nos. 5,061,569 and4,4′,4″-tris[N-(3-methylphenyl)-N-phenylamino]triphenylamine (MTDATA) inwhich triphenylamine units are connected to result in 3 star burst type,described in JP-A No. 4-308688.

Further, it is possible to employ polymer materials in which the abovematerials are introduced into the polymer chain, or they are employed asa main chain of polymers.

Still further, it is possible to employ inorganic compounds such as ptype-Si or p type-SiC as a positive hole injecting material and apositive hole transporting material.

(5) Electron Transporting Layer

The electron transporting layer, as described herein, is composed ofmaterials which exhibit a function to transport electrons. In a broadsense, the electron transporting layer includes an electron injectinglayer and a positive hole blocking layer. It is possible to arrange theelectron transporting layer composed of a single layer or a plurality oflayers.

Electron transporting materials are not particularly limited. Any of thematerials, known in the art, employed in electron transporting materialsof conventional organic EL elements may be selected and employed.

Examples of the above electron transporting materials includephenanthroline derivatives, bipyridine derivatives, nitro-substitutedfluorene derivatives, diphenylquinone derivatives, thiopyrandioxidederivatives, heterocyclic tetracarboxylic anhydrides such asnaphthereneperylene, carbodiimide, fluorenylidenemethane derivatives,anthraquinodimethane and anthrone derivatives, and oxadiazolederivatives. Further, it is possible to employ, as an electrontransporting material and an electron injecting material, thiadiazolederivatives in which in the above oxadiazole derivatives, the oxygenatom of the oxadiazole ring is replaced with a sulfur atom, as well asquinoxaline derivatives having a quinoxaline ring known as an electronattractive group.

Further, it is possible to employ polymer materials in which the abovematerials are introduced into the polymer chain, or these materials areemployed as a main chain of the polymers.

Further, it is possible to employ metal complexes.

(6) Formation of Organic Layer

The above organic layer may desirably be prepared employing any of thedry system film making methods such as a vapor deposition method or asputtering method, the wet system film making methods such as dipping, aspin coating method, a dip coating method, a casting method, a rollercoating method, a bar coating method, or a gravure coating method, aswell as the transfer method, and the printing method.

In order to realize high productivity, one of the features of thepresent invention is that at least 80% by weight of the organic layer ona substrate is prepared employing the wet process selected from theabove wet system film making methods and the printing method. The filmmaking ratio via the wet process varies depending on the types ofmaterials of the organic layer, but the upper limit is 100% by weight.

Of the above methods, the wet system film making methods areadvantageous in points such that it is possible to readily prepare theabove organic layer of a large area and organic EL elements whichexhibit high luminance and excellent light emitting efficiency areefficiently papered at lower cost. Further, it is possible toappropriately select the type of the film making method according tomaterials of the above organic layer. In the case of film makingemploying the above wet system film making methods, drying mayappropriately carried out. The above drying conditions are notparticularly limited, and temperature may be selected within the rangeso that a layer formed by coating is not adversely affected.

When the above organic layer is formed by coating employing the abovewet system film making method, it is possible to add binder resins tothe above organic layer. In this case, listed as the above binder resinsare polyvinyl chloride, polycarbonate, polystyrene, polymethylmethacrylate, polybutyl methacrylate, polyester, polysulfone,polyphenylene oxide, polybutadiene, hydrocarbon resins, ketone resins,phenoxy resins, polyamide, ethyl cellulose, vinyl acetate, ABS resins,polyurethane, melamine resins, unsaturated polyester, alkyd resins,epoxy resins, silicone resins, polyvinyl butyral, and polyvinyl acetal.These may be employed individually or in combinations of at least twotypes.

When the above organic layer is formed by coating employing the wetsystem film forming method, solvents, which are employed to prepare aliquid coating composition by dissolving materials of the above organiclayer, are not particularly limited and may appropriately be selecteddepending on the types of the above positive hole transportingmaterials, the above orthometal complexes, the above host materials, andthe above polymer binders. Examples include halogen based solvents suchas chloroform, carbon tetrachloride, dichloromethane,1,2-dichloroethane, or chlorobenzene; ketone based solvents such asacetone, methyl ethyl ketone, diethyl ketone, n-propyl methyl ketone, orcyclohexane; aromatic solvents such as benzene, toluene, or xylene;ester based solvents such as ethyl acetate, n-propyl acetate, n-butylacetate, methyl propionate, ethyl propionate, γ-butyrolactone, ordiethyl carbonate; ether based solvents such as dioxane; amide basedsolvents such as dimethylformamide or dimethylacetamide;dimethylsulfoxide, and water.

Meanwhile, the weight of solids with respect to the total weight ofsolvents, which dissolve them, is not particularly limited, and theresulting viscosity may appropriately be selected depending on the wetsystem film making method.

In the present invention, by employing the transfer method to form alight emitting layer, it is possible to avoid blending and dissolutionwith other layers, whereby it is possible to efficiently form amulti-layered organic layer. Further, by forming an interface betweenthe light emitting organic layer and the non-light emitting organiclayer exhibiting positive hole transportability and/or the non-lightemitting organic layer exhibiting electron transportability, it becomespossible to preferably control carrier mobility, whereby it has beenfound to make it possible to prepare a high performance organic ELelement.

The transfer method, as described herein, refers to the method whichincludes the process in which by employing a plurality of transfermaterials which have formed the organic layer on the temporary support,the organic layer is transferred onto a substrate via a peeling-transfermethod. Peeling-transfer method refers to a method in which by heatingand/or pressing transfer materials, the organic layer is softened, andafter adhesion to the film forming surface of a substrate, the organiclayer is only allowed to remain on the film making surface. With regardto the heating method and the pressing method, it is possible to employthe same method which is employed in the above lamination method.

(7) Transfer Materials

(7-1) Temporary Support

It is essential that the temporary support for the transfer sheetemployed in the present invention is composed of materials which arechemically and thermally stable, as well as also flexible. In practice,preferred is a thin sheet composed of fluororesins (for example, atetrafluorinated ethylene resin (PTFE), a trifluorinated chlorinatedethylene resin (PCTFE)), polyester (for example, polyethyleneterephthalate and polyethylene naphthalate (PEN)), polyacrylate,polycarbonate, polyolefin (for example, polyethylene and polypropylene),polyethersulfone (PES), or a laminated body thereof. Appropriatethickness of the temporary support is 1-300 μm, while when an organiclayer of highly detailed pattern is formed, the thickness is preferably3-20 μm.

(7-2) Formation of Organic Layer on Temporary Support

It is preferable that an organic layer, incorporating polymer compoundsas a binder, is formed on a temporary support via the wet-system method.Materials for the organic layer are dissolved in organic solvents to thedesired concentration, and the resulting solution is applied onto thetemporary support. Coating methods are not particularly limited as longas the thickness of the dried organic layer is at most 200 nm at auniform layer thickness distribution. Coating methods include a spincoating method, a screen printing method, a gravure coating method (forexample, a micro-gravure coating method), a dip coating method, a castcoating method, a die coating method, a roller coating method, a barcoating method, an extrusion coating method, and an ink-jet coatingmethod. Of these, preferred are the micro-gravure coating method and theink-jet method, which are preferred for patterning.

By sequentially coating a liquid coating composition incorporating lightemitting compounds of each color via mask onto the predeterminedpattern, it is also possible to form an organic layer in which lightemitting pixels of three colors, namely blue, green, and red, aresubjected to patterning.

Further, by sequentially transferring the coating film incorporating thelight emitting compounds of each color via a mask onto the predeterminedpattern, it is possible to form an organic layer in which light emittingpixels of three colors of blue, green, and red are subjected topatterning.

The mask materials are not limited, but preferred are those which aredurable and relatively inexpensive, which may be employed incombination. Further, in view of mechanical strength and patternaccuracy of light emitting pixels of the organic layer, the thickness ofthe mask is commonly 2-100 μm, but is preferably 5-60 μm.

(7-3) Patterning Method of Light Emitting Materials

One example of the production method of a patterning member according tothe present invention will now be described with reference to drawings.

FIG. 7 is one example showing a process flow of the production method ofthe patterning member employed in the present invention.

In the present embodiment, as shown in FIG. 7, employed as primarytransfer sheet 102 of various types, are three types of primary transfersheet 102R for red, primary transfer sheet 102G for green, and primarytransfer sheet 102B for blue. It is possible to preferably employ abelt-like flexible support as the various type primary transfer sheet102.

The belt-like flexible support is a sheet having the predeterminedshape, and it is possible to apply, onto the above support, varioustypes of different materials (pattern materials) P. Further, it ispossible to employ materials capable of transferring material P totransfer sheet 110 during the transfer process. Namely, it is requiredthat under conditions during the transfer process, wettability oradhesion property of material P is inferior to transfer sheet 110.

As such belt-like flexible supports, it is possible to employ a plasticfilm composed of polyethylene terephthalate (PET),polyethylene-2,6-naphthalate, cellulose diacetate, cellulose triacetate,cellulose acetate propionate, polyvinyl chloride, polyvinylidenechloride, polycarbonate, polyimide, or polyamide, paper, paper coated orlaminated by α-polyolefins having 2-20 carbon atoms such aspolyethylene, polypropylene, ethylene-butene copolymers, flexiblebelt-like materials such as a metal plate, and belt-like materials whichare prepared by forming a treated layer on the surface of the abovebelt-like materials. The width and length are specified, and the typicalthickness is about 2-200 μm.

Coating apparatus (coating means) 101, shown in FIG. 7, accepts a rollercoating apparatus as one example. In this roller coating apparatus,pattern material P of a predetermined thickness is applied onto primarytransfer sheet 102 in such a manner that primary transfer sheet 102 isconveyed at a predetermined rate in the arrowed direction underapplicator roller 101A which rotates in the direction shown in FIG. 7.On the rear side of applicator roller 101A, arranged is metering roller101B, and controlled is so that the supply amount of pattern material Ponto applicator roller 101A becomes uniform.

Primary transfer sheet 102 may be conveyed via the embodiment in whichit is fed from the roller of the feeding section (not shown) and iswound by the roller of a winding section (not shown) via coatingapparatus 101 and drying means 104 (to be described below). Further,another embodiment may be acceptable in which primary transfer sheet 102of a predetermined size is secured via a primary transfer sheet holdingtable (for example, a vacuum adsorption table) and is conveyed tocoating apparatus 101.

Coating apparatus 101 may be employed so that one unit coats variouspattern materials P, while coating apparatus 101 may be provided foreach of the various pattern materials P.

Systems of coating apparatus 101 are not limited in practice as long asit enables coating of pattern material P of the predetermined thicknessonto primary transfer sheet 102 as described above.

Primary transfer sheet 102 coated with pattern material P is conveyed todrying apparatus (drying means) 104, and pattern material P is dried.Usable drying apparatus 104 includes various dryers of various systems,such as a hot air circulation drier system, an infrared drier system, avacuum drier system.

It is preferable that a series of the above processes are carried outunder an ambience at a high degree of dust-free as well as at optimaltemperature and humidity. Consequently, it is preferable that they arecarried out in a clean room, and particularly, it is preferable thatcoating means 101 and drying means 104 are arranged under an ambience ofat most Class 100. For this, it is possible to accept an embodiment tosimultaneously employ a down-flow clean room or a clean bench.

In the present invention, pattern material P is the light emitting layerof the organic EL. Since moisture adversely affects product life, it ispreferable to store the above light emitting layer at an ambience of lowhumidity. In practice, preferable ambience is air or nitrogen gas at andew point of at most −20° C. It is also preferable to maintain relativehumidity as low as possible.

Transfer apparatus (transfer means) 105 employed for the transferprocess is an apparatus which transfers pattern material P onto transfersheet 110 to be pattern-like in such a manner that one of primarytransfer sheets 102 overlaps transfer sheet 110 so that pattern materialP faces transfer sheet 102 via mask M (mask material) having an apertureof the shape almost similar to the pattern and pressing pressure isapplied onto the rear surface of primary transfer sheet 102 via pressingplate 103.

As a material of transfer sheet 110 supplied in the above process, it ispossible to preferably employ a belt-like flexible support.

As such belt-like flexible supports, it is possible to employ plasticfilms composed of polyethylene terephthalate (PET),polyethylene-2,6-naphthalate, cellulose diacetate, cellulose triacetate,cellulose acetate propionate, polyvinyl chloride, polyvinylidenechloride, polycarbonate, polyimide, or polyamide, paper, paper coated orlaminated with α-polyolefins having 2-20 carbon atoms such aspolyethylene, polypropylene, ethylene-butene copolymers, flexiblebelt-like materials such as a metal plate, and belt-like materials whichare prepared by forming a treatment layer on the surface of the abovebelt-like materials as a substrate. Their width is specified, theirlength is 45-20,000 m, and their thickness is about 2-200 μm.

As shown in the structural view of FIG. 8, employed as mask M (maskmaterial) is a thin plate-like member having aperture section MA almostsimilar to the pattern in shape. Arrangement of aperture section MA onmask M is set to correspond to the pattern of each of the materials (R,G, and B). The size of aperture section MA is almost similar to theshape of the pattern, but it is preferable that the size is somewhatlarger than the pattern. This will be detailed later. For example, whena pattern is a rectangle of 100 μm×200 μm, it is preferable to makeaperture section MA to be rectangle of 105 μm×205 μm.

It is possible to accept the optimal value as a thickness of mask Mdepending on the size of the pattern, the layer thickness of the patternand the required accuracy for the pattern, and the commonly andpreferably acceptable values are in the range of 20-40 μm. In view ofaccuracy required for the pattern, it is preferable that the thicknessof mask M is as low as possible, while in view of durability (workinglife) and stiffness of mask M, it is preferable that the thickness ofmask M is high.

It is preferable that four sides of the above mask are retained viaframe materials and supported under a predetermined tension. Preferablyemployed as of mask M material is, for example, stainless steel.Formation of aperture section MA of mask M is carried out viaphotoetching.

As shown in the structural view of FIG. 9, employed as pressing plate103 is a plate-like member on which surface projections 103A, which arealmost similar to the shape of the pattern, are formed. The arrangementof projections 103A on pressing plate 103 is based to correspond to thepattern of each of the materials (R, G, and B). It is preferable thatthe size of projection 103A is almost similar to the pattern or issomewhat less than the same. This will be detailed. In practice, forexample, when a pattern is a rectangle of 100×200 μm, it is preferableto employ the same as above.

It is possible to accept the optimal value of the level difference ofprojection 103A of pressing plate 103, depending on the size of thepattern, the film thickness of the pattern, and the accuracy requiredfor the pattern, but the commonly acceptable value is 30-70 μm. In viewof the required accuracy for the pattern, namely molding accuracy ofprojection 103A, it is preferable that the bump of projection 103A is aslow as possible, while in view of the transferability of the pattern, itis preferable that the bump of projection 103A is somewhat larger.

It is preferable that such pressing plate 103 is molded of metal memberbeing thicker than the predetermined value. Formation of projection 103Aof pressing plate 103 is performed via photoetching.

In alignment transfer zone 106, in order to accurately align transfersheet 110 with primary transfer sheet 102, it is preferable that tensionapplied to transfer sheet 110 is relatively small. Namely, it ispreferable to minimize elastic deformation of transfer sheet 110 forhighly accurate alignment. Specifically, when transfer sheet 110 is heldby substrate supporting base 107 via adsorption, it is preferable thatno tension is applied.

Transfer apparatus (transfer means) 105 shown in FIG. 5 is an embodimentcorresponding to transfer sheet 110 of the belt-like flexible support.When plate-like transfer sheet 110 such as a glass plate, a siliconsubstrate, or a metal plate is employed, the basic structure is almostthe same except for differing in conveyance means.

Alignment transfer zone 106 will now be detailed with reference to FIGS.7 and 10. FIG. 10 is a schematic view showing the flow of a transferprocess. In FIGS. 7 and 10, “up” and “down” are reversed. Further, inFIG. 10, substrate supporting base 107 is not shown.

In FIG. 10, alignment transfer means 105 is composed of: mask M whichsupports primary transfer sheet 102 on the upper surface; a maskalignment means (not shown), which performs alignment of mask M in theX, Y, Z, and θ directions; substrate supporting base 107 (refer to FIG.7) in which a flat surface is molded and which supports the substratevia adsorption onto the rear surface; at least two alignment detectionmeans (not shown) which are arranged near both edges of primary transfersheet 102 to enable alignment and which are capable of aligning mask Mor detecting the pattern section of transfer sheet 110; pressing plate103 which transfers, pattern-like, pattern material P to transfer sheet110 via aperture section MA of mask M by pressing projection 103A fromthe rear surface of primary transfer sheet 102; and a pressing means(not shown) which presses pressing plate 103 onto the side of transfersheet 110.

It is possible to constitute the mask alignment means, which aligns maskM in the X, Y, Z, and θ directions via a common means employing acombination of such as ball screws and a stepping motor. Adsorptionsecuring of transfer sheet 110 in substrate supporting base 107 may beachieved, for example by a combination of a plurality of tiny vacuumadsorption holes arranged on the surface of substrate supporting base107 and a suction means (for example, a rotary type vacuum pump) whichis connected to those holes. It is possible to constitute the alignmentdetection means via a combination of a microscope or a digital cameraand a CRT monitor connected to it.

As a pressing means, employed may be any common ones in which acombination of an air cylinder and a regulator results in planarpressure. Further, instead of such planar pressing structure, it ispossible to employ a linear pressing method employing a roller member.Namely, a structure is usable in which a roller member is conveyed whilepressure is applied to the rear surface of pressing plate 103 via theabove roller member.

Further, it is possible to employ a manual pressing system in whichwhile viewing the detection results of the alignment detection means, anoperator aligns in the X, Y, X and θ directions of mask M, or anautomatic system in which, based on detection results of the alignmentdetection means, alignment in the X, Y, Z, and θ directions of mask M isautomatically achieved.

It is essential that alignment in the X, Y, Z, and θ directions ispossible so that projection 103 of pressing plate 103 is settable inaperture section MA of mask M in all positions. In order to achieve theabove, it is possible to accept such an embodiment that as a structure,it is possible to position and fix mask M and pressing plate 103 viaoff-line setup while being movable only in the Z direction.

Further, it is also possible to provide a positioning means only forpressing plate 103 to achieve its positioning in the X, Y, Z, and θdirections. In view of accuracy of the alignment, the above ispreferable, though resulting in burden for facilities. In this case, itis possible to employ the above-described alignment detection means toalign pressing plate 103 and mask M. Namely, by changing the focallength, the alignment detection means is applicable.

Initially from the state shown in FIG. 7, substrate supporting base 107descends, and supports transfer sheet 110 via adsorption at the positionwhich comes into nearly contact with the rear surface (being the uppersurface) of transfer sheet 110. Subsequently, as shown in FIG. 10( a),primary transfer sheet 102 is supported on mask M and at the same time,via mask M, primary transfer sheet 102 is allowed to approach and facetransfer sheet 110. In such a state, mask M is aligned in the X, Y, Z,and θ directions. Further, if desired, pressing plate 103 is aligned inthe X, Y, Z, and θ directions.

In the above alignment, it is necessary that over the whole surface ofmask M, projection 103A of pressing plate 103 nearly corresponds toaperture section MA of mask M, and when pressing plate 103, is conveyedto the transfer sheet 110 side, and adjustment is achieved so thatprojection 103A is in the state to be settable in aperture section MA ofmask M.

When the above alignment is completed, pattern material P is transferredonto transfer sheet 110 by pressing the rear surface of plate 30 viapressing means. The above states are sequentially shown in FIGS. 10( b)and (c). Namely, since primary transfer sheet 102 is thin, it isstretched and is pushed into aperture section MA of mask M viaprojection 103A of pressing plate 103. By doing so, pattern material Pon a part of primary transfer sheet 102 pushed into aperture section MAis pressed on transfer sheet 110, and finally transferred onto transfersheet 110.

As shown in FIGS. 10( b) and (c), it is found that the width of thepattern transferred onto transfer sheet 110 is less than that ofaperture section MA of mask M and the width of the pattern is more thanthat of projection 103A of pressing plate 103. Since the above sectionalstate is formed, it is necessary to design the width of aperture sectionMA of mask M and the width of projection 103A of pressing plate 103while considering the design width of the pattern, the thickness ofprimary transfer sheet 102, the elongation magnitude of primary transfersheet 102, the mechanical characteristics (for example, longitudinalelastic coefficient) of primary transfer sheet 102, and the filmthickness of pattern material P.

After pattern material P is transferred onto transfer sheet 110,pressing plate 103, mask M, and primary transfer sheet 102 are withdrawnfrom the transfer sheet 110 side. The above operation is repeated, forexample, for three R, G, and B colors, to form the substrate shown inFIGS. 10( e) and 11.

It is preferable that structure is made so that during transfer,predetermined pressure and if needed, predetermined heat are applieddepending on the shape and materials of pattern material P. Employed asa heating means may, for example, be a structure in which a sheathheater is provided in the interior of pressing plate 103.

When transfer of the first type of pattern material P is completed,substrate supporting base 107 (refer to FIG. 7) and transfer sheet 110secured by the above stand without any change. Subsequently, the firsttype of primary transfer sheet 102 and mask M are replaced with anotherprimary transfer sheet 102 and mask M. During this operation, anothermask M is aligned while shifted by one pitch of the stripe or matrixpattern.

Alignment of the second type of mask M and the following is made bydetecting, via an alignment detection means, an alignment mark formednear both edges to result in a pertinent positional relationship withrespect to pattern material P of the first type formed on the surface oftransfer sheet 110, or by detecting pattern material P of the first typevia alignment detection means. The above operation is carried out forall types of mask M, and transfer of pattern material P to transfersheet 110 is completed.

Incidentally, in cases in which alignment is made by detecting patternmaterial P of the first type and the like via the alignment detectionmeans, when part of substrate supporting base 107 or mask M is formedvia transparent materials, or part of substrate supporting base 107 iscut off, it is possible to conveniently detect pattern material of thefirst type via the alignment detection means through above substratesupporting base 107 or mask M.

Further, when the mask alignment means is allowed to support mask M,structure is preferred in which alignment pins are arranged at threepositions of the mask alignment means, and two sides of the frame ofmask M come into contact with the alignment pins while being pressed,whereby mask is supported at the same position. Structure may also beemployed in which passing-through holes are formed at the alignmentposition of mask alignment means with mask M and alignment is made byjoining via passing-through pin (in this case, a taper-like pin ispreferred) which passes through the holes.

When alignment of pattern material P is not required to be high, insteadof employing the above alignment detection means, it is possible toachieve mask alignment only by employing the above alignment pins.

With regard to transfer conditions, it is necessary to select optimalconditions depending on the materials of pattern material P and thematerials of transfer sheet 110. Applicable pressing pressure duringtransfer is 5-50 N/cm in terms of linear pressure, for example, when aroller member (being elastic roller such as a rubber roller) is employedand linear pressing is applied.

Further, during transfer, heating temperature is preferably 40-250° C.,but is more preferably 60-180° C. It is preferable to maintain thetemperature of primary transfer sheet 102 (pressing plate 103) and/ortransfer sheet 110 (substrate supporting base 107) to enable enhancementof productivity.

During transfer, it is important to pay attention to the presence of thedifference in thermal expansion coefficient among mask M, primarytransfer sheet 102, transfer sheet 110 and pressing plate 103. Forexample, at normal temperature (for example, 20° C.), even though bothedges of mask M (for example, stainless steel at α of 18×10⁻⁶) andtransfer sheet (for example, resin film at α of 80×10⁻⁶) are matched, inthe case of heating temperature of 150° C. during transfer, differencein the magnitude of thermal expansion of about 40 μm occurs, whichcauses un-negligible problems.

One of countermeasures is that structure is made so that the thermalexpansion coefficient α of each of the structural members is near asmuch as possible, and another countermeasure is that design is made sothat positional relationship of each structuring member becomes optimal.It is more preferable to employ both in combination.

Further, at completion of the transfer, when no appropriate temperaturecontrol is performed, during withdrawal of pressing plate 103 from theedge of transfer sheet 110, it may be afraid that projection 103A set inaperture section MA of mask M is not released.

After completion of the transfer process, under a state in whichadhesion force between pattern material P and transfer sheet 110 isassured, winding onto winding roller 130 is carried out.

FIG. 11 is a structural view of transfer sheet 110 after completion oftransfer. On the above transfer sheet 110, pattern material P of threetypes (R, G, and B) is repeatedly formed at the predetermined width andpitch.

The production method of the pattern member according to the presentinvention is described above; however, the present invention is notlimited the above embodiments and is subjected to various embodiments.

For example, with regard to the types and number of primary sheets 102,the number of coating apparatus 101, and drying apparatus 104, thelayout, and the arrangement of the transfer apparatus, other than theabove embodiments, it is possible to select various embodimentsdepending on the product size of the pattern member, the types ofproducts and the production quantity.

In the present embodiment, drying apparatus 104 of a batch system isemployed, but it is possible to employ an embodiment in which primarytransfer sheet 102 is conveyed via rollers, and a tunnel furnace typedrying apparatus is provided in the latter stage.

In the present embodiment, mask M is prepared so that it is employed foreach of pattern material P and is employed via exchange. However, it ispossible to employ an embodiment in which one type of mask M is fixed inthe mask alignment means, which is employed in common for each patternmaterial P.

Further, for example, in transfer equipment (a transfer means) 105, itis possible to employ structure in which alignment is made by shifting 1pitch of substrate supporting base 107 (transfer sheet 110) instead ofthe structure in which alignment of subsequent mask M is made byshifting 1 pitch of the stripe or the matrix pattern.

Further, in the example of the above embodiment, the drying process isemployed in which the transfer sheet coated with the pattern member isdried. However, depending on the materials of the pattern member, it ispossible to employ a transfer process without employing a dryingprocess.

(f) Moisture and/or Oxygen Absorbing Layer

(1) Materials

It is preferable that the materials employed in the moisture and/oroxygen absorbing layer of the present invention are reducing metaloxides, or metals or alloys of a work function of at most 4.0 eV.

“Reducing metal oxides”, as described herein, refer to oxides, in whichthe atom, which bonds to oxygen, has the oxidation number which is lessthan the atomic valence. Examples of the reducing oxides which areemployed in the moisture and/or oxygen absorbing layer include SiO, GeO,SnO, FeO, MNO, and WO. Of these, preferred are SiO, GeO, SnO, and FeO.

Examples of metals or alloys of a work function of at most 4.0 eVinclude metals such as Ca, Ce, Cs, Er, Eu, Gd, Hf, K, La, Li, Mg, Nd,Rb, Sc, Sm, Y, Yb, or Zn, and alloys which are composed of the abovemetals as major components. Of these, in view of ease of procurement andhandling, particularly preferred are Ca, Li, and Mg, as well as alloysthereof.

As materials of the moisture and/or oxygen absorbing layer, reducingoxides and metals or alloys of a work function of at most 4.0 eV may beemployed in combination. When employed in combination, the moistureand/or oxygen absorbing layer may be multi-layered or both may bedispersed into a single layer.

(2) Arrangement Method

The moisture and/or oxygen absorbing layer is arranged between a cathodesubstrate and a cathode. By realizing the above structure, it ispossible to efficiently absorb moisture and/or oxygen incorporated inthe substrate as well as moisture and/or oxygen penetrated intoelements, whereby it is possible to enhance durability and luminance oforganic EL elements.

Arrangement methods of the moisture and/or oxygen absorbing layer arenot particularly limited. A vapor deposition method or a sputteringmethod is preferred, and the method which is the same as the cathodearrangement method is preferred. By arranging the moisture and/or oxygenabsorbing layer employing the same method as the cathode arrangementmethod, it is possible to continuously arrange the cathode afterarranging the moisture and/or oxygen absorbing layer, whereby it ispossible to simplify the process. An interlayer such as an insulationlayer may be arranged between the moisture and/or oxygen absorbing layerand the cathode or the cathode substrate.

The thickness of the moisture and/or oxygen absorbing layer is notparticularly limited as long as reducing oxides and/or metals or alloysof a work function of at most 4.0 eV are incorporated, which absorb asufficient amount of moisture and/or oxygen to enhance durability oforganic EL elements. The above thickness is preferably 10 nm-1 μm, butis more preferably 50-500 nm. The thickness of the absorbing layer whichis less than the lower limit is not preferred since moisture absorbingcapacity is not sufficient. On the other hand, the thickness whichexceeds the upper limit is not also preferred since longer period isrequired for film making and in addition, peeling problems of thecathode substrate or the cathode and the absorbing layer tend to occur.

(g) Other Layers

Other layers are not particularly limited and may be selectedappropriately depending on purposes. For example, listed are aprotective layer and a drying layer. Appropriately listed as the aboveprotective layer are those described, for example, in JP-A Nos. 7-85974,7-1925866, 8-22891, 10-275682, and 10-106746. The shape, size, andthickness may be suitably selected. The materials are not particularlylimited as long as they function to retard penetration and entry ofthose such as moisture or oxygen to degrade organic EL elements into theabove organic EL elements. Examples include silicon oxide, silicondioxide, germanium oxide, and germanium dioxide.

Methods to form the above protective layer are not particularly limitedand include, for example, a vacuum deposition method, a sputteringmethod, a reactive sputtering method, a molecular beam epitaxy method, acluster-ion beam method, an ion plating method, a plasma polymerizationmethod, a plasma CVD method, a laser CVD method, a thermal CVD method,and a coating method.

Materials of the drying layer are not particularly limited, and thosewhich adsorb moisture are preferably employed. Preferably employed are,for example, reducing oxides such as SiO, GeO, FeO, or SnO, as well asmetals and alloys of a work function of at most 4.0 eV. The drying layeris preferably arranged between a cathode and a cathode substrate.Arranging methods are not particularly limited and include, for example,a vacuum deposition method, a sputtering method, a reactive sputteringmethod, a molecular beam epitaxy method, a cluster ion beam method, anion plating method, a plasma polymerization method, a plasma CVD method,a laser CVD method, a thermal CVD method, and a coating method.

The organic EL element of the present invention enables light emissionby applying direct current (if required, an alternating currentcomponent may be included) voltage (usually, 2-40 V) or direct currentelectricity between the above anode and the above cathode. Driving theorganic EL element of the present invention may be carried out utilizingthe methods described in JP-A Nos. 2-148687, 6-301355, 5-29080,7-134558, 8-234685, and 8-241047, as well as U.S. Pat. Nos. 5,828,429,6,023,308, and 2,784,615.

The following compounds are listed as specific compounds of thestructural layer.

The structural layer includes a positive hole injecting layer, apositive hole transporting layer, a light emitting layer, and anelectron transporting layer.

For example, in the positive hole injecting layer, employed areconjugated type polymers and non-conjugated type polymers, and oligomercompounds. In order to enhance electrical conductivity, the abovecompounds are subjected to acceptor doping and then employed.

Listed as conjugated type polymers are polythiophenes and polyanilines,which are usually subjected to doping via acid. Specifically preferredas polythiophenes is PEDOT/PSS, and as polyanilines is PANI/CSA.

Non-conjugated type polymers include aromatic amines and those in whicharomatic amine is introduced into the primary chain or side chain.Examples include those represented by Formulas 1 and 2. Of these,preferred are PC-TPB-DEG, PTPDES, Et-PTPDEK, PVTPA1, and PVTPA2.

Preferred as acceptors are those exhibiting extremely high electronacceptability. Preferred examples include TBPAH, quinones, and DDQ isparticularly preferred.

Further, also listed as non-conjugated type polymers are condensed typepolymers, which include the compounds represented by following FormulaA.

wherein Ar represents an aryl group and a heteroaryl group, each ofwhich has a substitutable position and may independently be substituted,m represents an integer of 1-4, n represents an integer of 1-4, Zrepresents a residual group of a fluorescent or phosphorescent compound(including organic complexes). Of (m+2) substitutable positions of Ar, mpositions are bonded via K. K represents a bivalent linking group or abonding means. Z of m pieces and L, all may be the same or differ. Lrepresents a bivalent linking group selected from following Group 1 ofLinking Groups.

Group 1 of Linking Groups

-   -   R₁-R₄ each represent a hydrogen atom,    -   an alkyl group which may be    -   substituted, an aryl group, and a    -   heteroaryl group.

The following compounds are listed as specific examples of thesecompounds.

Oligomer compounds include aromatic amine oligomers. Those which havethe structure, in which aromatic amines are linked, may be subjected tosublimation purification, and exhibit good amorphousness. Those arerepresented by any of following Formulas 3-6, and examples thereofinclude following Compounds 3-1-5, 4-1-4, 5-1-4 and 6-1-3.

Preferred as acceptors are those which exhibit very high electronacceptability, and preferred examples include above TBPAH and quinones.Of these, DDQ is particularly preferred.

In the positive hole transporting layer, employed are aromatic aminesmodified to polymers, amorphous low molecular weight compounds, andliquid crystal compounds.

The aromatic amines modified to polymers include those in which aromaticamines are introduced into a primary chain or a side chain, and whichare represented by Formulas 1 and 2. Preferred examples includePC-TPB-DEG, PTPDES, Et-PTPDEK, PVTPA1 and PVTPA2.

Amorphous low molecular weight compounds, as described herein, are thosewhich can be purified via sublimation and exhibit excellent amorphousproperties when coated.

Such amorphous low molecular weight compounds include aromatic amineoligomers. Even though having a structure in which aromatic amine islinked, they can be purified via sublimation and exhibit excellentamorphous properties when coated. Examples include Compounds 3-1-5,4-1-4, and 6-1-3, represented by above Formulas 3-6.

Any of the liquid crystal compounds are applicable as long as theyexhibit liquid crystal properties, and include triphenylene derivativesand polyfluorene derivatives exhibiting discotic properties. Further, toenhance positive hole transportability, positive hole transportingdopants may be incorporated.

Conjugated type polymers, non-conjugated type polymers, and amorphouslow molecular weight compounds are employed to form a light emittinglayer.

The conjugated type polymers include polyphenylenevinylene derivatives,polythiophene derivatives, polyparaphenylene derivatives, polyacetylenederivatives, and polymers in which phosphorescent molecules areintroduced into the primary chain.

Polyphenylenevinylene derivatives are those represented by followingFormula 7 and examples thereof include PPV, RO-PPV, and CN-PPV.

Polythiophene derivatives are those represented by following Formula 8and examples thereof include PAT, PCHMT, and POPT.

Polyparaphenylene derivatives are those represented by following Formula9 and examples thereof include PPP, RO-PPP, FP-PPP, and PDAF.

Polyacetylens are those represented by following Formula 10 and examplesthereof include PPA and PDPA.

Polymers, in which phosphorescent molecules are introduced into theprimary chain, are those in which phosphorescent molecules capable ofemitting phosphorescence are introduced into the primary chain.Preferred as the phosphorescent molecules are orthometal complexes andplatinum complexes, and Ir complexes are particularly preferred. Theexamples thereof are those represented by following Formula 11 andinclude Compounds 11-1 and 11-2.

The non-conjugated type polymers are those in which functional moleculesare bonded in the side chain and are represented by following Formula12, which include PVCz and Compound 12-1.

Further, employed may be polymers in which phosphorescent molecules arebonded to the side chain. Examples include Compounds 13-1 and 13-2,represented by Formula 13.

As noted above, amorphous low molecular weight compounds, as describedherein, are those which can be purified via sublimation and exhibitexcellent amorphous properties when coated. Compounds which exhibitdesired amorphous properties are preferably those of relatively high Tg(glass transition temperature). Examples thereof are represented by anyof above Formulas 3-6 and following Formula 14-17, which includeCompounds 3-1-5, 4-1-4, 5-1-4, 6-1-3, 14-1-15, 15-1-4, 16-1-3, and17-1-5.

If desired, added to the above polymers or compounds may be dopantswhich include a light emitting dopant and an electric chargetransporting dopant. Listed as the light emitting dopants arefluorescent dopants and phosphorescent dopants. They are selecteddepending on desired emitted color. As fluorescent dopants, those whichexhibit a high fluorescent quantum yield are preferred, which includelaser dyes.

As phosphorescent dopants, compounds, of which phosphorescence isobserved at room temperature, are preferred. Of these, orthometalcomplexes, platinum complexes are preferred, and Ir complexes are morepreferred. Examples include Ir-1-13.

Electric charge transporting dopants include positive hole transportingdopants and electron transporting dopants. Listed as the positive holedopants are aromatic amines, while listed as the electron transportingdopants are heterocycles.

It is possible to employ the polymers or compounds listed for the lightemitting layer to form an electron transporting layer. If desired,electron transporting dopants may be employed, and examples thereofinclude heterocyclic compounds. Further, a mixture of a plurality ofpolymers listed herein and other polymers may be employed. Stillfurther, monomers which are employed to synthesize the above polymersand monomers of polymers listed herein or monomers of other polymers arecopolymerized and the resulting copolymers may be employed in thepresent invention.

It is possible to employ the organic EL element of the present inventionas a display and a light emitting light source. In the display, it ispossible to display full-color by employing three types of organic ELelements emitting blue, red and red lights.

Displays include televisions, personal computers, mobile devices, AVdevices, letter broadcasting displays, and information displays inautomobiles. Specifically, it is possible to use it as a display toreproduce still and moving images. A driving system, when employed as adisplay for reproducing moving images, may be either a simple matrix(passive matrix) system or an active matrix system.

Light emitting light sources include home lighting, car interiorlighting, backlight for clocks and liquid crystals, advertisementboards, traffic lights, light sources of optical memory media, lightsources of electrophotographic copiers, light sources of opticalprocessing processors, and light sources of optical sensors. The organicEL elements of the present invention are suitable for various types oflighting.

EXAMPLES

The present invention will now be detailed with reference to examples;however, the present invention is not limited thereto.

Examples Preparation of Organic EL Element 1

Full-color Organic EL Element 1 composed of a cathodesubstrate/cathode/electron transporting layer/light emittinglayer/positive hole transporting layer/anode/anode substrate wasprepared as described below.

(A) Preparation of Cathode Laminated Body 1 (AnodeSubstrate/Anode/Electron Transporting Layer)

Both sides of a sheet of Al foil (at a thickness of 30 μm) was laminatedwith a 50 μm thick polyimide sheet (UPILEX 50S, produced by UbeIndustries, Ltd.), and the resulting foil was cut to 35 mm×40 mm,whereby a cathode substrate was prepared.

The above cathode substrate was placed in a cleaning vessel. Aftercleaning it via i-propyl alcohol (IPA), it was subjected to oxygenplasma treatment. Subsequently, a mask (a mask arranged with stripes ofa line width of 300 μm and an interval of 30 μm, as shown in FIG. 12)was arranged, and Al was vapor-deposited at a reduced pressure of about0.1 mPa, whereby a stripe-structured cathode of a film thickness of 0.2μm was formed (refer to FIG. 13).

Continuously, as an electron injecting member, LiF was vapor-depositedin the same pattern as the Al layer, whereby a 3 nm thick electroninjecting layer was formed.

Subsequently, the above mask was removed and an electron transportingorganic layer liquid coating composition, formulated as described below,was applied employing a spin coater and the resulting coating was driedat 60° C. to form a 40 nm thick electron transporting layer, wherebyCathode Laminated body 1 was prepared.

Electron Transporting Compound 12-1  40 parts by weight (Mw of 50,000)Dichloroethane 3200 parts by weight(B) Preparation of Anode Laminated Body 1 (AnodeSubstrate/Anode/Positive Hole Transporting Layer)

A 0.7 mm×35 mm×40 mm glass plate, employed as an anode substrate, wasintroduced into a vacuum chamber, and a patterned mask (a mask arrangedwith stripes of a line width of 960 μm and an interval of 30 μm, shownin FIG. 14) was arranged. Subsequently, employing an ITO target (at amole ratio of indium:tin of 95:5) containing 10% SnO₂ by weight, astripe structure anode composed of a 0.2 μm thick ITO thin layer wasformed (refer to FIG. 15).

The surface conductivity of the above node was 10Ω/□•••••• The anodesubstrate on which the above anode was formed was placed in a cleaningvessel and cleaned with isopropyl alcohol, followed by an oxygen plasmatreatment. The following composition was applied onto the surface of thetreated transparent electrode via spin coating, and the resultingcoating was dried at 40° C. to form a 100 nm thick positive holetransporting layer, whereby Anode Laminated Body 1 was prepared.

Positive hole transporting compound (PTPDES) 40 parts by weight Additive(TBPAH) 10 parts by weight Dichloroethane 3200 parts by weight (C) Formation of Light Emitting Organic Layer Patterned onto TransferSheet(1) Preparation of Primary Transfer Sheet(a) Preparation of Primary Transfer Sheet for Blue

Polyvinyl carbazole (Mw of 63,000, produced by Aldrich, Co.) and iridiumcomplex (Ir-12) as an orthometal complex at a weight ratio of 40:1) weredissolved in dichloromethane. The resulting liquid coating compositionwas applied onto a 5 μm thick temporary support composed of PET film(produced by Teijin Ltd.) via a gravure coater and dried, whereby a 40nm thick blue light emitting layer (light emitting pixels) of alongitudinal length of 960 μm and a lateral length of 300 μm which ispattern-like at longitudinal and lateral cycles of 990 μm was prepared.The pattern arrangement was subjected to a stripe arrangement (refer toFIG. 16).

(b) Preparation of Primary Transfer Sheet for Green

Polyvinyl carbazole (Mw of 63,000, produced by Aldrich Co.), and iridiumcomplex (Ir-1) as an orthometal complex at a weight ratio of 40:1 weredissolved in dichloromethane. The resulting liquid coating compositionwas applied onto a 5 μm thick temporary support composed of PET film(produced by Teijin Ltd.) via a gravure coater and dried, whereby a 40nm thick green light emitting layer (light emitting pixels) of alongitudinal length of 960 μm and a lateral length of 300 μm which ispattern-like at longitudinal and lateral cycles of 990 μm was prepared.The pattern arrangement was subjected to a stripe arrangement in thesame manner as blue (refer to FIG. 16).

(c) Preparation of Primary Transfer Sheet for Red

Polyvinyl carbazole (Mw of 63,000, produced by Aldrich Co.), and iridiumcomplex (Ir-9) as an orthometal complex at a weight ratio of 40:1 weredissolved in dichloromethane. The resulting liquid coating compositionwas applied onto a 5 μm thick temporary support composed of PET film(produced by Teijin Ltd.) via a gravure coater and dried, whereby a 40nm thick red light emitting layer (light emitting pixels) of alongitudinal length of 960 μm and a lateral length of 300 μm which ispattern-like at longitudinal and lateral cycles of 990 μm was prepared.The pattern arrangement was subjected to a stripe arrangement in thesame manner as blue (refer to FIG. 16).

As described above, three types of primary transfer materials wereprepared in which light emitting pixels of blue, green, and red areformed to be pattern-like.

(2) Preparation of Transfer Sheet which are Subjected to B, G, and RPatterning.

The organic layer side of the primary transfer sheet for blue wasoverlapped onto a 5 μm thick temporary support for a transfer sheet,composed of a PET film (produced by Teijin Ltd.), and heat and pressurewere applied onto the rear side of the primary transfer sheet viaconveyance at a rate of 0.05 m/minute between paired rollers exhibitinga pressing pressure of 0.3 MPa (one roller being a 160° C. heatingroller). Subsequently, by peeling the primary transfer sheet from thetemporary support, a blue light emitting layer was transferred onto thetransfer sheet (refer to FIG. 17).

Subsequently, the organic layer side of the primary transfer sheet forgreen was overlapped by shifting by one-third cycle (330 μm) in thelateral direction of the pixels so that pixels were not overlapped, andthe green light emitting layer was transferred onto a transfer sheet(refer to FIG. 19).

(D) Transfer of Light Emitting Organic Layer to Cathode Laminated Body 1

The light emitting organic layer side of the transfer sheet which wassubjected to B, G, and R patterning, prepared in (C) was overlapped onthe electron transporting layer side of cathode laminated body 1,prepared as in (A), so that light emitting pixels and the stripedpattern in the longitudinal direction of the cathode coincided. Heat andpressure were applied onto the rear side of the transfer sheet viaconveyance at a rate of 0.05 m/minute between paired rollers exhibitinga pressing pressure of 0.3 MPa (one roller being a 160° C. heatingroller). Subsequently, by peeling the transfer sheet from the cathodesubstrate, a B, G, and R three-color light emitting layer wastransferred onto the electron transporting side of Cathode LaminatedBody 1 (cathode substrate/cathode/electron transporting layer), preparedin (A), whereby First Laminated Body 1 (refer to FIG. 20) was prepared.

(E) Lamination of First Laminated Body 1 with Anode Laminated Body 1

The light emitting side of First Laminated Body 1 prepared in (D) wasfaced with the positive hole transporting layer of Anode Laminated Body1 and overlapped so that the striped pattern in the lateral direction oflight emitting pixels coincided with the striped pattern of the anode.Subsequently, overlapping was carried out by rotating the long edge by90 degrees as shown in FIG. 21.

Heat and pressure were applied onto the support side of First LaminatedBody 1 via conveyance at a rate of 0.05 m/minute between paired rollersexhibiting a pressing pressure of 0.3 MPa (one roller being a 160° C.heating roller), whereby First Laminated Body 1 and Anode Laminated Body1 were laminated.

Subsequently, an aluminum lead was extended from each of the lines ofthe anode and the cathode, whereby a 32-pixel×32-pixel passive drivingtype full-color organic EL element, composed of an cathodesubstrate/cathode/electron transporting layer/light emittinglayer/positive hole transporting layer/anode/anode substrate, wasprepared.

(F) Sealing of Side Section

UV curing type epoxy based adhesive agent XNR5493T (produced by NagaseCiba Co., Ltd.) was coated in the adhesive agent position, shown in FIG.2, of the organic EL element prepared as above to reach a layerthickness of 1 mm, employing a dispenser. After coating, ultravioletradiation at an intensity of 100 mw/cm² was exposed onto both sides ofthe organic EL element, employing a high pressure mercury lamp, toresult in curing, whereby Organic Element 1 of the present invention wasprepared. Meanwhile, the above sealing was carried out in the globe boxin which the ambient air was replaced with nitrogen. The dew point was−60° C., and oxygen concentration was 10 ppm.

Example 2

As described below, full-color Organic EL Element 2 was prepared, whichwas composed of a cathode substrate/cathode/electron transportinglayer/light emitting layer/positive hole transporting layer/anode/anodesubstrate.

(A) Preparation of Cathode Laminated Body 2 (CathodeSubstrate/Cathode/Electron Transporting Layer)

Both sides of an Al foil (at a thickness of 30 μm) was laminated with a50 μm thick polyimide sheet (UPILEX 50S, produced by Ube Industries,Ltd.), and the resulting foil was cut to 35 mm×40 mm, whereby a cathodesubstrate was prepared.

The above cathode substrate was placed in a cleaning vessel. Aftercleaning it via i-propyl alcohol (IPA), an oxygen plasma treatment wasapplied. Subsequently, a mask (a mask arranged with stripes of a linewidth of 300 μm and an interval of 30 μm, shown in FIG. 12) fordeposition, which was subjected to patterning, was arranged, and Al wasvapor-deposited at a reduced pressure of about 0.1 mPa, whereby astripe-structured cathode of a film thickness of 0.2 μm was formed(refer to FIG. 12).

Continuously, as an electron injecting material, LiF was vapor-depositedin the same pattern as the Al layer, whereby a 3 nm thick electroninjecting layer was formed.

Subsequently, the above mask was removed and an electron transportingorganic layer liquid coating composition, formulated as described below,was applied employing a spin coater and the resulting coating was driedat 60° C. to form a 40 nm thick electron transporting layer, wherebycathode laminated body 2 was prepared.

Electron Transporting Compound 12-1  40 parts by weight (Mw of 50,000)Dichloroethane 3200 parts by weight(B) Preparation of Anode Laminated Body 2 (AnodeSubstrate/Anode/Positive Hole Transporting Layer)

A 0.7 mm×35 mm×40 mm glass plate employed as an anode substrate wasintroduced into a vacuum chamber, and a patterned mask (a mask arrangedwith stripes of a line width of 960 μm and an interval of 30 μm, shownin FIG. 14) was arranged. Subsequently, employing an ITO target (at amole ratio of indium:tin of 95:5) containing 10% SnO₂ by weight, astripe structured anode composed of a 0.2 μm thick ITO thin layer wasformed (refer to FIG. 15).

The surface conductivity of the above anode was 10Ω/□•••••• The anodesubstrate on which the above anode was formed was placed in a cleaningvessel and cleaned with isopropyl alcohol, followed by an oxygen plasmatreatment. The following composition was applied onto the surface of thetreated transparent electrode via spin coating, and the resultingcoating was dried at 40° C. to form a 100 nm thick positive holetransporting layer, whereby anode laminated body 2 was prepared.

Positive hole transporting compound (PTPDES) 40 parts by weight Additive(TBPAH) 10 parts by weight Dichloroethane 3200 parts by weight (C) Formation of Light Emitting Organic Layer Patterned onto TransferSheet(1) Preparation of Primary Transfer Sheet(a) Preparation of Primary Transfer Sheet for Blue

Compound CP-2 (Mw of 50,000) and iridium complex (Ir-12) as anorthometal complex at a weight ratio of 40:1 were dissolved indichloromethane. The resulting liquid coating composition was appliedonto a 5 μm thick temporary support composed of PET film (produced byTeijin Ltd.) via an extrusion type coating apparatus and dried, wherebya 40 nm thick blue light emitting layer was prepared.

(b) Preparation of Primary Transfer Sheet for Green

Compound CP-2 (Mw of 50,000) and tris(2-phenylpyridine)iridium complex(Ir-1) as an orthometal complex at a weight ratio of 40:1 were dissolvedin dichloromethane. The resulting liquid coating composition was appliedonto a 5 μm thick temporary support composed of PET film (produced byTeijin Ltd.) via an extrusion type coating apparatus and dried, wherebya 40 nm thick green light emitting layer was prepared.

Compound CP-2 (Mw of 50,000) and iridium complex (Ir-9) as an orthometalcomplex at a weight ratio of 40:1 were dissolved in dichloromethane. Theresulting liquid coating composition was applied onto a 5 μm thicktemporary support composed of PET film (produced by Teijin Ltd.) via anextrusion type coating apparatus and dried, whereby a 40 nm thick bluelight emitting layer was prepared.

As described above, three types of primary transfer materials of blue,green, and red light emitting organic layers were prepared on temporarysupports.

(2) Preparation of Transfer Sheet which were Subjected to B, G, and RPatterning.

On the temporary support for a transfer sheet composed of 5 μm thick PETfilm (produced by Teijin Ltd.), sequentially overlapped were astripe-structured mask (of 50 mm×50 mm, and a thickness of 30 μm, havingholes in a striped pattern of a longitudinal length of 970 μm and alateral length of 310 μm and longitudinal and lateral cycles of 990 μm,refer to FIG. 22), so that the center of the mask holes coincided withthe projections of the pressing plate. Subsequently, heat and pressurewere applied onto the support side of the primary transfer sheet viabeing conveyed at a rate of 0.05 m/minute between paired rollersexhibiting a pressing pressure of 0.3 MPa (one roller being a 160° C.heating roller). Subsequently, by peeling the pressing plate, theprimary transfer sheet, and the mask from the temporary support, a bluelight emitting layer was transferred onto the transfer sheet (refer toFIG. 17).

Further, the mask, the primary transfer sheet for green, and thepressing plate were overlapped by a shift of one third cycle (330 μm) inthe lateral direction of the pixels so that blue and green pixels werenot overlapped, and the green light emitting layer was transferred ontoa transfer sheet in the same manner as the blue light emitting layer(refer to FIG. 18).

Finally, the mask, the primary transfer sheet for red, and the pressingplate were overlapped by a shift of one third cycle (330 μm) in thelateral direction of the pixels so that blue, green, and red pixels werenot overlapped, and the red light emitting layer was transferred in thesame manner as the green light emitting layer, whereby a transfer sheet,which had been subjected to B, G, and red patterning, was prepared(refer to FIG. 19).

(D) Transfer of Light Emitting Organic Layer to Cathode Laminated Body 2

The electron transporting side of Cathode Laminated Body 2 prepared in(A) was overlapped on the light emitting layer side of the transfersheet prepared in (C) which had been subjected to patterning so thatlight emitting pixels and the striped pattern in the longitudinaldirection of the cathode coincided. Heat and pressure were applied ontothe rear side of the transfer sheet via conveyance at a rate of 0.05m/minute between paired rollers exhibiting a pressing pressure of 0.3MPa (one roller being a 160° C. heating roller). Subsequently, bypeeling the transfer sheet from the cathode substrate, B, G, and Rthree-color light emitting layer was transferred onto the electrontransporting side of Cathode Laminated Body 2 (cathodesubstrate/cathode/electron transporting layer), prepared in (A), wherebyFirst Laminated Body 2 (refer to FIG. 20) was prepared.

(E) Lamination of First Laminated Body 2 with Anode Laminated Body 2

The light emitting side of First Laminated Body 1 prepared in (D) wasmade to face the positive hole transporting layer of Anode LaminatedBody 2 and overlapped so that the striped pattern in the lateraldirection of light emitting pixels coincided with the striped pattern ofthe anode. Subsequently, overlapping was carried out by rotating thelong side direction by 90 degrees as shown in FIG. 21.

Heat and pressure were applied onto the support side of First LaminatedBody 2 via conveyance at a rate of 0.05 m/minute between paired rollersexhibiting a pressing pressure of 0.3 MPa (one roller being a 160° C.heating roller), whereby First Laminated Body 2 and Anode Laminated Body2 were laminated.

Subsequently, an aluminum lead was extended from each of the lines ofthe anode and the cathode, whereby a 32-pixel×32-pixel passive drivingtype full-color organic EL element, composed of a cathodesubstrate/cathode/electron transporting layer/light emittinglayer/positive hole transporting layer/anode/anode substrate, wasprepared.

(F) Sealing of Side Section

UV curing type epoxy based adhesive agent XNR5493T (produced by NagaseCiba Co., Ltd.) was coated in the adhesive agent position, shown in FIG.2, of the organic EL element prepared as above to reach a layerthickness of 1 mm, employing a dispenser. After coating, ultravioletradiation at an intensity of 100 mw/cm² was exposed onto both sides ofthe organic EL element, employing a high pressure mercury lamp, toachieve curing, whereby Organic Element 2 of the present invention wasprepared. Meanwhile, the above sealing was carried out in the globe boxin which the ambient air was replaced with nitrogen. The dew point was−60° C., and oxygen concentration was 10 ppm.

Example 3 Preparation of Organic EL Element 3

As described below, full-color Organic EL Element 3 was prepared, whichwas composed of a cathode substrate/cathode/electron transportinglayer/light emitting layer/positive hole transporting layer/anode/anodesubstrate.

(A) Preparation of Cathode Laminated Body 3 (CathodeSubstrate/Cathode/Electron Transporting Layer)

Both sides of an Al foil (at a thickness of 30 μm) was laminated with a50 μm thick polyimide sheet (UPILEX 50S, produced by Ube Industries,Ltd.), and the resulting foil was cut to 35 mm×40 mm, whereby a cathodesubstrate was prepared.

The above cathode substrate was placed in a cleaning vessel. Aftercleaning it with i-propyl alcohol (IPA), an oxygen plasma treatment wasapplied. Subsequently, a mask (a mask arranged with stripes of a linewidth of 300 μm and an interval of 30 μm, shown in FIG. 12) fordeposition, which was subjected to patterning, was arranged, and Al wasvapor-deposited at a reduced pressure of about 0.1 mPa, whereby astriped cathode of a film thickness of 0.2 μm was formed (refer to FIG.12).

Subsequently, as an electron injecting material, LiF was vapor-depositedin the same pattern as the Al layer, whereby a 3 nm thick electroninjecting layer was formed.

Subsequently, the above mask was removed and an electron transportingorganic layer liquid coating composition, formulated as described below,was applied employing a spin coater and the resulting coating was driedat 60° C. to form a 40 nm thick electron transporting layer, wherebyCathode Laminated Body 3 was prepared.

Electron Transporting Compound 12-1  40 parts by weight (Mw of 50,000)Dichloroethane 3200 parts by weight(B) Preparation of Anode Laminated Body 3 (AnodeSubstrate/Anode/Positive Hole Transporting Layer)

A 0.7 mm×35 mm×40 mm glass plate, employed as an anode substrate, wasintroduced into a vacuum chamber, and a mask (a mask arranged withstripes of a line width of 960 μm and an interval of 30 μm, shown inFIG. 14) for deposition, which had been subjected to patterning, wasarranged. Subsequently, employing an ITO target (at a mole ratio ofindium:tin of 95:5) containing 10% SnO₂ by weight, a striped anodecomposed of a 0.2 μm thick ITO thin layer was formed via DC magnetronsputtering (conditions: temperature of the substrate support of 250° C.and an oxygen pressure of 1×10⁻⁴ Pa) (refer to FIG. 15).

The surface conductivity of the above node was 10Ω/□•••••• The anodesubstrate on which the above anode was formed was placed in a cleaningvessel and cleaned with isopropyl alcohol, followed by an oxygen plasmatreatment. The following composition was applied onto the surface of thetreated transparent electrode via spin coating, and the resultingcoating was dried at 40° C. to form a 100 nm thick positive holetransporting layer, whereby Anode Laminated Body 3 was prepared.

Positive hole transporting compound (PTPDES) 40 parts by weight Additive(TBPAH) 10 parts by weight Dichloroethane 3200 pars by weight(C) Formation of Light Emitting Organic Layer Patterned onto TransferSheet: Mask Transfer Method-2(1) Preparation of Primary Transfer Sheet(a) Preparation of Primary Transfer Sheet for Blue

Compound CP-2 (Mw of 50,000), and iridium complex (Ir-12) as anorthometal complex at a weight ratio of 40:1 were dissolved indichloromethane. The resulting liquid coating composition was appliedonto a 5 μm thick temporary support composed of PET film (produced byTeijin Ltd.) via an extrusion type coating apparatus and dried, wherebya 40 nm thick blue light emitting layer was prepared.

(b) Preparation of Primary Transfer Sheet for Green

Compound CP-2 (Mw of 50,000), and tris(2-phenylpyridine)iridium complex(Ir-1) as an orthometal complex at a weight ratio of 40:1 were dissolvedin dichloromethane. The resulting liquid coating composition was appliedonto a 5 μm thick temporary support composed of PET film (produced byTeijin Ltd.) via an extrusion type coating apparatus and dried, wherebya 40 nm thick green light emitting layer was prepared.

(c) Preparation of Red Primary Transfer Sheet

Compound CP-2 (Mw of 50,000), and iridium complex (Ir-9) as anorthometal complex at a weight ratio of 40:1 were dissolved indichloromethane. The resulting liquid coating composition was appliedonto a 5 μm thick temporary support composed of PET film (produced byTeijin Ltd.) via an extrusion type coating apparatus and dried, wherebya 40 nm thick red light emitting layer was prepared.

As described above, three types of primary transfer materials of blue,green, and red light emitting organic layers were prepared on thetemporary support.

(2) Preparation of Transfer Sheet which were Subjected to B, G, and RPatterning.

On the temporary support for a transfer sheet composed of 5 μm PET film(produced by Teijin Ltd.), sequentially overlapped were an oblique linearranged mask (of 50 mm×50 mm, and a thickness of 30 μm, a longitudinallength of 970 μm and a lateral length of 310 μm, longitudinal andlateral cycles of 990 μm, having holes in an oblique arrangement patternwhich shifted in the longitudinal direction by one third cycle (330 μm)for every one longitudinal cycle, refer to FIG. 24), the organic layerside, of the primary transfer sheet for blue, and the pressing plate (50mm×50 mm, a longitudinal length of 970 μm and a lateral length of 300μm, a longitudinal and lateral cycle of 990 μm, having projections of aheight of 30 μm in an oblique arrangement pattern which shifted in thelongitudinal direction by one third cycle (330 μm) for every onelongitudinal cycle (refer to FIG. 25), so that the center of the maskhole coincided with the projection of the pressing plate on the organiclayer side. Subsequently, heat and pressure were applied onto the rearside of the primary transfer sheet via being conveyed at a rate of 0.05m/minute between paired rollers exhibiting a pressing pressure of 0.3MPa (one roller was a heating roller at 160° C.). Subsequently, bypeeling the pressing plate, the primary transfer sheet, and the maskfrom the temporary support, a blue light emitting layer was transferredonto the transfer sheet (refer to FIG. 26). Subsequently, the mask, theprimary transfer sheet for green, and the pressing plate were overlappedby a shift of one third cycle (330 μm) in the lateral direction of thepixels so that blue and green pixels were not overlapped, and the greenlight emitting layer was transferred onto a transfer sheet in the samemanner as the blue light emitting layer (refer to FIG. 27).

Finally, the mask, the primary transfer sheet for red, and the pressingplate were overlapped by a shift of one third cycle (330 μm) in thelateral direction of the pixels so that blue, green, and red pixels werenot overlapped, and the red light emitting layer was transferred in thesame manner as the green light emitting layer, whereby a transfer sheet,which ad been subjected to B, G, and R patterning, was prepared (referto FIG. 28).

(D) Transfer of Light Emitting Organic Layer to Cathode Laminated Body 3

The electron transporting side of Cathode Laminated Body 3, prepared in(A, was overlapped on the light emitting layer side of the transfersheet prepared in (C) which had been subjected to B, G, and R patterningso that light emitting pixels and the striped pattern in thelongitudinal direction of the cathode coincided. Heat and pressure wereapplied onto the rear side of the transfer sheet via conveyance at arate of 0.05 m/minute between paired rollers exhibiting a pressingpressure of 0.3 MPa (one roller being a 160° C. heating roller).Subsequently, by peeling the transfer sheet from the cathode substrate,B, G, and R three-color light emitting layer was transferred onto theelectron transporting side of Cathode Laminated Body 3 (being a cathodesubstrate/cathode/electron transporting layer), prepared in (A), wherebyFirst Laminated Body 3 (refer to FIG. 29) was prepared.

(E) Lamination of First Laminated Body 3 with Anode Laminated Body 3

The light emitting side of First Laminated Body 3 prepared in (D) wasmade to face the positive hole transporting layer of Anode LaminatedBody 3 and overlapped so that the striped pattern in the lateraldirection of light emitting pixels coincided with the striped pattern ofthe anode. Subsequently, overlapping was carried out by rotating thelong side direction by 90 degrees as shown in FIG. 30.

Heat and pressure were applied onto the support side of First LaminatedBody 3 via conveyance at a rate of 0.05 m/minute between paired rollersexhibiting a pressing pressure of 0.3 MPa (one roller being a 160° C.heating roller), whereby First Laminated Body 3 and Anode Laminated Body3 were laminated.

Subsequently, an aluminum lead was extended from each of the lines ofthe anode and the cathode, whereby a 32-pixel×32-pixel passive drivingtype full-color organic EL element, composed of a cathodesubstrate/cathode/electron transporting layer/light emittinglayer/positive hole transporting layer/anode/anode substrate, wasprepared.

(F) Sealing of Side Section

UV curing type epoxy based adhesive agent XNR5493T (produced by NagaseCiba Co., Ltd.) was coated in the adhesive agent position, shown in FIG.2, of the organic EL element prepared as above to reach a layerthickness of 1 mm, employing a dispenser. After coating, ultravioletradiation at an intensity of 100 mW/cm² was exposed onto both sides ofthe organic EL element, employing a high pressure mercury lamp, toresult in curing, whereby Organic Element 2 of the present invention wasprepared. The above sealing was carried out in the globe box in whichambient air was replaced with nitrogen. The dew point was −60° C., andoxygen concentration was 10 ppm.

Example 4 Preparation of Organic EL Element 4

As described below, full-color Organic EL Element 4 was prepared, whichwas composed of a cathode substrate/cathode/electron transportinglayer/light emitting layer/positive hole transporting layer/anode/anodesubstrate.

(A) Preparation of Cathode Laminated Body 4 (CathodeSubstrate/Cathode/Electron Transporting Layer/Positive Hole BlockingLayer)

Both sides of an Al foil (at a thickness of 30 μm) was laminated with a50 μm thick polyimide sheet (UPILEX 50S, produced by Ube Industries,Ltd.), and the resulting foil was cut to 35 mm×40 mm, whereby a cathodesubstrate was prepared.

The above cathode substrate was placed in a cleaning vessel. Aftercleaning it with i-propyl alcohol (IPA), an oxygen plasma treatment wasapplied. Subsequently, a mask (a mask arranged with stripes of a linewidth of 300 μm and an interval of 30 μm, shown in FIG. 12) fordeposition, which had been subjected to patterning, was arranged, and Alwas vapor-deposited at a reduced pressure of about 0.1 mPa, whereby astriped cathode of a film thickness of 0.2 μm was formed (refer to FIG.13).

Subsequently, as an electron injecting material, LiF was vapor-depositedin the same pattern as the Al layer, whereby a 3 nm thick electroninjecting layer was formed.

Subsequently, the above mask was removed and an electron transportingorganic layer liquid coating composition, formulated as described below,was applied employing a spin coater and the resulting coating was driedat 60° C., whereby a 40 nm thick electron transporting layer wasprepared.

Electron Transporting Compound 12-1  40 parts by weight (Mw of 50,000)Dichloroethane 3200 parts by weight

Subsequently, the liquid coating composition for the organic layer ofthe positive hole blocking agent, as formulated below, was applied via aspray coating apparatus, and the resulting coating was dried at 60° C.to form a 10 nm thick positive hole blocking layer, whereby CathodeLaminated Body 4 was prepared.

Positive hole blocking material BC  40 parts by weight Dichloroethane3200 parts by weight

(B) Preparation of Anode Laminated Body 4 (AnodeSubstrate/Anode/Positive Hole Transporting Layer)

A 0.7 mm×35 mm×40 mm glass plate, employed as an anode substrate, wasintroduced into a vacuum chamber, and a mask (a mask arranged withstripes of a line width of 960 μm and an interval of 30 μm, shown inFIG. 14) for deposition, which had been subjected to patterning, wasarranged. Subsequently, employing an ITO target (at a mole ratio ofindium:tin of 95:5) containing 10% SnO₂ by weight, a striped anodecomposed of a 0.2 μm thick ITO thin layer was formed via DC magnetronsputtering (conditions: temperature of the substrate support of 250° C.and an oxygen pressure of 1×10⁻⁴ Pa) (refer to FIG. 15).

The surface conductivity of the above anode was 10Ω/□•••••• The anodesubstrate on which the above anode was formed was placed in a cleaningvessel and cleaned with isopropyl alcohol, followed by an oxygen plasmatreatment. The following composition was applied onto the surface of thetreated transparent electrode via spin coating, and the resultingcoating was dried at 40° C. to form a 100 nm thick positive holetransporting layer, whereby Anode Laminated Body 4 was prepared.

Positive hole transporting compound (PTPDES) 40 parts by weight Additive(TBPAH) 10 parts by weight Dichloroethane 3200 pars by weight(C) Formation of Light Emitting Organic Layer which was Subjected toPattering onto Transfer Sheet: Mask Transfer Method(1) Preparation of Primary Transfer Sheet(a) Preparation of Primary Transfer Sheet for Blue

Compound CP-2 (of a molecular weight of 50,000), and iridium complex(Ir-12) as an orthometal complex at a weight ratio of 40:1 weredissolved in dichloromethane. The resulting liquid coating compositionwas applied onto a 5 μm thick temporary support composed of PET film(produced by Teijin Ltd.) via an extrusion type coating apparatus anddried, whereby a 40 nm thick blue light emitting layer was prepared.

(b) Preparation of Primary Transfer Sheet for Green

Compound CP-2 (of an Mw of 50,000), and tris(2-phenylpyridine)iridiumcomplex (Ir-1) as an orthometal complex at a weight ratio of 40:1 weredissolved in dichloromethane. The resulting liquid coating compositionwas applied onto a 5 μm thick temporary support composed of PET film(produced by Teijin Ltd.) via an extrusion type coating apparatus anddried, whereby a 40 nm thick green light emitting layer was prepared.

(c) Preparation of Red Primary Transfer Sheet

Compound CP-2 (of an Mw of 50,000), and iridium complex (Ir-9) as anorthometal complex at a weight ratio of 40:1 were dissolved indichloromethane. The resulting liquid coating composition was appliedonto a 5 μm thick temporary support composed of PET film (produced byTeijin Ltd.) via an extrusion type coating apparatus and dried, wherebya 40 nm thick red light emitting layer was prepared.

As described above, three types of primary transfer materials of blue,green, and red light emitting organic layers were prepared on thetemporary support.

(2) Preparation of Transfer Sheet which were Subjected to B, G, and RPatterning.

On the temporary support for a transfer sheet composed of 5 μm thick PETfilm (produced by Teijin Ltd.), sequentially overlapped were a stripedmask (of 50 mm×50 mm, and a thickness of 30 μm, having holes in astriped pattern of a longitudinal length of 970 μm and a lateral lengthof 310 μm and longitudinal and lateral cycles of 990 μm, refer to FIG.22), the organic layer side of the primary transfer sheet for blue, andthe pressing plate (50 mm×50 mm, a longitudinal length of 970 μm and alateral length of 300 μm, a longitudinal and lateral cycle of 990 μm,having projections of a height of 30 μm (refer to FIG. 23)) so that thecenter of the mask hole coincided with the projection of the pressingplate. Subsequently, heat and pressure were applied onto the supportside of the primary transfer sheet via conveyance at a rate of 0.05m/minute between paired rollers exhibiting a pressing pressure of 0.3MPa (one roller being a 160° C. heating roller). Subsequently, bypeeling the pressing plate, the primary transfer sheet, and the maskfrom the temporary support, a blue light emitting layer was transferredonto the transfer sheet (refer to FIG. 17).

Subsequently, the mask, the primary transfer sheet for green, and thepressing plate were overlapped by a shift of one third cycle (330 μm) inthe lateral direction of the pixels so that blue and green pixels werenot overlapped, and the green light emitting layer was transferred ontoa transfer sheet in the same manner as the blue light emitting layer(refer to FIG. 18).

Finally, the mask, the primary transfer sheet for red, and the pressingplate were overlapped by a shift of one third cycle (330 μm) in thelateral direction of the pixels so that blue, green, and red pixels werenot overlapped, and the red light emitting layer was transferred in thesame manner as the green light emitting layer, whereby a transfer sheet,which was subjected to B, G, and red patterning, was prepared (refer toFIG. 19).

(D) Transfer of Light Emitting Organic Layer to Cathode Laminated Body 4

The electron transporting side of cathode laminated body 4 prepared in(A) was overlapped on the light emitting layer side of the transfersheet prepared in (C) which had been subjected to patterning so thatlight emitting pixels and the striped pattern in the longitudinaldirection of the cathode coincided. Heat and pressure were applied ontothe rear side of the transfer sheet via conveyance at a rate of 0.05m/minute between paired rollers exhibiting a pressing pressure of 0.3MPa (one roller being a 160° C. heating roller). Subsequently, bypeeling the transfer sheet from the cathode substrate, B, G, and Rthree-color light emitting layer was transferred onto cathode laminatedbody (cathode substrate/cathode/electron transporting layer/positivehole blocking layer), prepared in (A), whereby First Laminated Body 4(refer to FIG. 20) was prepared.

(E) Lamination of First Laminated Body 4 with Anode Laminated Body 4

The light emitting layer side of First Laminated Body 1 prepared in (D)was made to face the positive hole transporting layer of Anode LaminatedBody 4 and overlapped so that the striped pattern in the lateraldirection of light emitting pixels coincided with the striped pattern ofthe anode. Subsequently, overlapping was carried out by rotating thelong side direction by 90 degrees as shown in FIG. 21.

Heat and pressure were applied onto the support side of the firstlaminated body 4 via conveyance at a rate of 0.05 m/minute betweenpaired rollers exhibiting a pressing pressure of 0.3 MPa (one rollerbeing a 160° C. heating roller), whereby First Laminated Body 4 andAnode Laminated Body 4 were laminated.

Subsequently, an aluminum lead was extended from each of the lines ofthe anode and the cathode, whereby a 32-pixel×32-pixel passive drivingtype full-color organic EL element, composed of a cathodesubstrate/cathode/electron transporting layer/positive hole blockinglayer/light emitting layer/positive hole transporting layer/anode/anodesubstrate, was prepared.

(F) Sealing of Side Section

UV curing type epoxy based adhesive agent XNR5493T (produced by NagaseCiba Co., Ltd.) was coated in the adhesive agent position, shown in FIG.2, of the organic EL element prepared as above to reach a layerthickness of 1 mm, employing a dispenser. After coating, ultravioletradiation at an intensity of 100 mW/cm² was exposed onto both sides ofthe organic EL element, employing a high pressure mercury lamp, toresult in curing, whereby Organic EL Element 4 of the present inventionwas prepared. The above sealing was carried out in the globe box inwhich ambient air was replaced with nitrogen. The dew point was −60° C.,and oxygen concentration was 10 ppm.

Example 5 Preparation of Organic EL Element 5

As described below, full-color Organic EL Element 5 was prepared, whichwas composed of a cathode substrate/moisture-oxygen absorbinglayer/cathode/electron transporting layer/light emitting layer/positivehole transporting layer/anode/anode substrate.

(A) Preparation of Cathode Laminated Body 5 (CathodeSubstrate/Moisture-Oxygen Absorbing Layer/Cathode/Electron TransportingLayer/Cathode/Electron Transporting Layer)

Both sides of an Al foil (at a thickness of 30 μm) was laminated with a50 μm thick polyimide sheet (UPILEX 50S, produced by Ube Industries,Ltd.), and the resulting foil was cut to 35 mm×40 mm, whereby a cathodesubstrate was prepared.

The above cathode substrate was placed in a cleaning vessel. Aftercleaning it with i-propyl alcohol (IPA), an oxygen plasma treatment wasapplied. Subsequently, SiO₂ was vapor-deposited at a pressure-reducedambience of about 0.1 mPa, whereby a 0.1 μm thick moisture-oxygenabsorbing layer was prepared.

Subsequently, a mask (a mask arranged with stripes of a line width of300 μm and an interval of 30 μm, shown in FIG. 12) for deposition, whichwas subjected to patterning, was arranged, and Al was vapor-deposited ata reduced pressure of about 0.1 mPa, whereby a 0.2 μm thick cathode wasformed. Further, as an electron injecting material, LiF wasvapor-deposited in the same pattern as the Al layer, whereby a 3 nmthick electron injecting layer was formed.

Subsequently, the above mask was removed and an electron transportingorganic layer liquid coating composition, formulated as described below,was applied employing a spin coater and the resulting coating was driedat 60° C., to form a 40 nm thick electron transporting layer, wherebyCathode Laminated Body 5 was prepared.

Electron Transporting Compound 12-1  40 parts by weight (of Mw of50,000) Dichloroethane 3200 parts by weight(B) Preparation of Anode Laminated Body 5 (AnodeSubstrate/Anode/Positive Hole Transporting Layer)

A 0.7 mm×35 mm×40 mm glass plate, employed as an anode substrate, wasintroduced into a vacuum chamber, and a mask (a mask arranged withstripes of a line width of 960 μm and an interval of 30 μm, shown inFIG. 14) for deposition, which has been subjected to patterning, wasarranged. Subsequently, employing an ITO target (at a mole ratio ofindium:tin of 95:5) containing 10% SnO₂ by weight, a striped anodecomposed of a 0.2 μm thick ITO thin layer was formed via DC magnetronsputtering (conditions: temperature of the substrate support of 250° C.and an oxygen pressure of 1×10⁻³ Pa) (refer to FIG. 15).

The surface conductivity of the above anode was 10Ω/□•••••• The anodesubstrate on which the above anode was formed was placed in a cleaningvessel and cleaned with isopropyl alcohol, followed by an oxygen plasmatreatment. The following composition was applied onto the surface of thetreated transparent electrode via spin coating, and the resultingcoating was dried at 40° C. to form a 100 nm thick positive holetransporting layer, whereby Anode Laminated Body 5 was prepared.

Positive hole transporting compound (PTPDES) 40 parts by weight Additive(TBPAH) 10 parts by weight Dichloroethane 3200 pars by weight(C) Formation of Light Emitting Organic Layer which was Subjected toPatterning onto Transfer Sheet: Mask Transfer Method(1) Preparation of Primary Transfer Sheet(a) Preparation of Primary Transfer Sheet for Blue

Compound CP-2 (Mw of 50,000), and iridium complex (Ir-12) as anorthometal complex at a weight ratio of 40:1 were dissolved indichloromethane. The resulting liquid coating composition was appliedonto a 5 μm thick temporary support composed of a PET film (produced byTeijin Ltd.) via an extrusion type coating apparatus and dried, wherebya 40 nm thick blue light emitting layer was prepared.

(b) Preparation of Primary Transfer Sheet for Green

Compound CP-2 (Mw of 50,000), and tris(2-phenylpyridine)iridium complex(Ir-1) as an orthometal complex at a weight ratio of 40:1 were dissolvedin dichloromethane. The resulting liquid coating composition was appliedonto a 5 μm thick temporary support composed of a PET film (produced byTeijin Ltd.) via an extrusion type coating apparatus and dried, wherebya 40 nm thick green light emitting layer was prepared.

(c) Preparation of Red Primary Transfer Sheet

Compound CP-2 (Mw of 50,000), and iridium complex (Ir-9) as anorthometal complex at a weight ratio of 40:1 were dissolved indichloromethane. The resulting liquid coating composition was appliedonto a 5 μm thick temporary support composed of a PET film (produced byTeijin Ltd.) via an extrusion type coating apparatus and dried, wherebya 40 nm thick red light emitting layer was prepared.

As described above, three types of primary transfer materials of blue,green, and red light emitting organic layers were prepared on thetemporary support.

(2) Preparation of Transfer Sheet which were Subjected to B, G, and RPatterning.

On the temporary support for a transfer sheet composed of 5 μm thick PETfilm (produced by Teijin Ltd.), sequentially overlapped were a stripedmask (of 50 mm×50 mm, and a thickness of 30 μm, having holes in astriped pattern of a longitudinal length of 970 μm and a lateral lengthof 310 μm and longitudinal and lateral cycles of 990 μm, refer to FIG.22), the organic layer side of the primary transfer sheet for blue, andthe pressing plate (50 mm×50 mm, a longitudinal length of 970 μm and alateral length of 300 μm, a longitudinal and lateral cycle of 990 μm,having projections of a height of 30 μm (refer to FIG. 23)) so that thecenter of the mask hole coincided with the projection of the pressingplate. Subsequently, heat and pressure were applied onto the supportside of the primary transfer sheet via conveyance at a rate of 0.05m/minute between paired rollers exhibiting a pressing pressure of 0.3MPa (one roller being a 160° C. heating roller). Subsequently, bypeeling the pressing plate, the primary transfer sheet, and the maskfrom the temporary support, a blue light emitting layer was transferredonto the transfer sheet (refer to FIG. 17).

Subsequently, the mask, the primary transfer sheet for green, and thepressing plate were overlapped by a shift of one third cycle (330 μm) inthe lateral direction of the pixels so that blue and green pixels werenot overlapped, and the green light emitting layer was transferred ontoa transfer sheet in the same manner as the blue light emitting layer(refer to FIG. 18).

Finally, the mask, the primary transfer sheet for red, and the pressingplate were overlapped by a shift of one third cycle (330 μm) in thelateral direction of the pixels so that blue, green, and red pixels werenot overlapped, and the red light emitting layer was transferred in thesame manner as the green light emitting layer, whereby a transfer sheet,which has been subjected to B, G, and red patterning, was prepared(refer to FIG. 19).

(D) Transfer of Light Emitting Organic Layer to Cathode Laminated Body 5

The electron transporting side of Cathode Laminated Body 5 prepared in(A) was overlapped on the light emitting layer side of the transfersheet prepared in (C) which had been subjected to patterning so thatlight emitting pixels and the striped pattern in the longitudinaldirection of the cathode coincided. Heat and pressure were applied ontothe rear side of the transfer sheet via conveyance at a rate of 0.05m/minute between paired rollers exhibiting a pressing pressure of 0.3MPa (one roller being a 160° C. heating roller). Subsequently, bypeeling the transfer sheet from the cathode substrate, B, G, and Rthree-color light emitting layer was transferred onto Cathode LaminatedBody 5 (cathode substrate/cathode/electron transporting layer), preparedin (A), whereby First Laminated Body 5 (refer to FIG. 20) was prepared.

(E) Lamination of First Laminated Body 5 with Anode Laminated Body 5

The light emitting layer side of the first laminated body prepared in(D) was made to faced the positive hole transporting layer of AnodeLaminated Body 5 and overlapped so that the striped pattern in thelateral direction of light emitting pixels coincided with the stripedpattern of the anode. Subsequently, overlapping was carried out byrotating the long side direction by 90 degrees as shown in FIG. 21.

Heat and pressure were applied onto the support side of the firstlaminated body 5 via conveyance at a rate of 0.05 m/minute betweenpaired rollers exhibiting a pressing pressure of 0.3 MPa (one rollerbeing a 160° C. heating roller), whereby First Laminated Body 5 andAnode Laminated Body 5 were laminated.

Subsequently, an aluminum lead was extended from each of the lines ofthe anode and the cathode, whereby a 32-pixel×32-pixel passive drivingtype full-color organic EL element, composed of a cathodesubstrate/moisture-oxygen absorbing layer/cathode/electron transportinglayer/light emitting layer/positive hole transporting layer/anode/anodesubstrate, was prepared.

(F) Sealing of Side Section

UV curing type epoxy based adhesive agent XNR5493T (produced by NagaseCiba Co., Ltd.) was coated in the adhesive agent position, shown in FIG.2 of the organic EL element prepared as above to reach a layer thicknessof 1 mm, employing a dispenser. After coating, ultraviolet radiation atan intensity of 100 mw/cm² was exposed onto both sides of the organic ELelement, employing a high pressure mercury lamp, to result in curing,whereby Organic EL Element 5 of the present invention was prepared. Theabove sealing was carried out in the globe box in which ambient air wasreplaced with nitrogen. The dew point was −60° C., and oxygenconcentration was 10 ppm.

(Preparation of Organic EL Element 6)

Full-color Organic EL Element 6 composed of a cathodesubstrate/cathode/electron transporting layer/light emittinglayer/positive hole transporting layer/anode/anode substrate wasprepared in the same manner as Example 1, except that an electrontransporting layer was prepared via vapor deposition.

(A) Preparation of Cathode Laminated Body 6 (CathodeSubstrate/Cathode/Electron Transporting Layer)

Both sides of an Al foil (at a thickness of 30 μm) was laminated with a50 μm thick polyimide sheet (UPILEX 50S, produced by Ube Industries,Ltd.), and the resulting foil was cut to 35 mm×40 mm, whereby a cathodesubstrate was prepared.

The above cathode substrate was placed in a cleaning vessel. Aftercleaning it with i-propyl alcohol (IPA), an oxygen plasma treatment wasapplied. Subsequently, a mask (a mask arranged with stripes of a linewidth of 300 μm and an interval of 30 μm, shown in FIG. 12) fordeposition, which had been subjected to patterning, was arranged, and Alwas vapor-deposited at a reduced pressure of about 0.1 mPa, whereby a0.2 μm thick striped cathode was formed (refer to FIG. 13).

Further, as an electron injecting material, LiF was vapor-deposited inthe same pattern as the Al layer, whereby a 3 nm thick electroninjecting layer was formed.

Subsequently, the above mask was removed, and an electron transportingmaterial having the following structure was subjected to deposition at areduced pressure of about 0.1 mPa to form a 40 nm thick electrontransporting layer, whereby Cathode Laminated Body 6 was prepared.

(B) Preparation of Anode Laminated Body 6 (AnodeSubstrate/Anode/Positive Hole Transporting Layer)

A 0.7 mm×35 mm×40 mm glass plate, employed as an anode substrate, wasintroduced into a vacuum chamber, and a mask (a mask arranged withstripes of a line width of 960 μm and an interval of 30 μm, shown inFIG. 14) for deposition, which had been subjected to patterning, wasarranged. Subsequently, employing an ITO target (at a mole ratio ofindium:tin of 95:5) containing 10% SnO₂ by weight, a striped anodecomposed of a 0.2 μm thick ITO thin layer was formed via DC magnetronsputtering (conditions: temperature of the substrate support of 250° C.and an oxygen pressure of 1×10⁻³ Pa) (refer to FIG. 15).

The surface conductivity of the above node was 10Ω/□•••••• The anodesubstrate, on which the above anode was formed, was placed in a cleaningvessel and cleaned with isopropyl alcohol, followed by an oxygen plasmatreatment. The following composition was applied onto the surface of thetreated transparent electrode via spin coating, and the resultingcoating was dried at 40° C. to form a 100 nm thick positive holetransporting layer, whereby Anode Laminated Body B was prepared.

Positive hole transporting compound (PTPDES) 40 parts by weight Additive(TBPAH) 10 parts by weight Dichloroethane 3200 pars by weight(C) Formation of Light Emitting Organic Layer which was Subjected toPatterning onto Transfer Sheet: Mask Transfer Method(1) Preparation of Primary Transfer Sheet(a) Preparation of Primary Transfer Sheet for Blue

Polyvinyl carbazole (Mw of 63,000, produced by Aldrich Co.), and iridiumcomplex (Ir-12) as an orthometal complex at a weight ratio of 40:1 weredissolved in dichloromethane. The resulting liquid coating compositionwas applied onto a 5 μm thick temporary support composed of a PET film(produced by Teijin Ltd.) via an extrusion type coating apparatus anddried, whereby a 40 nm thick blue light emitting layer was prepared.

(b) Preparation of Primary Transfer Sheet for Green

Polyvinyl carbazole (Mw of 63,000, produced by Aldrich Co.), andtris(2-phenylpyridine)iridium complex (Ir-1) as an orthometal complex ata weight ratio of 40:1 were dissolved in dichloromethane. The resultingliquid coating composition was applied onto a 5 μm thick temporarysupport composed of a PET film (produced by Teijin Ltd.) via anextrusion type coating apparatus and dried, whereby a 40 nm thick greenlight emitting layer was prepared.

(c) Preparation of Red Primary Transfer Sheet

Polyvinyl carbazole (Mw of 63,000, produced by Aldrich Co.), and iridiumcomplex (Ir-9) as an orthometal complex at a weight ratio of 40:1 weredissolved in dichloromethane. The resulting liquid coating compositionwas applied onto a 5 μm thick temporary support composed of a PET film(produced by Teijin Ltd.) via an extrusion type coating apparatus anddried, whereby a 40 nm thick red light emitting layer was prepared.

As described above, three types of primary transfer materials of blue,green, and red light emitting organic layers were prepared on thetemporary support.

(2) Preparation of Transfer Sheet which were Subjected to B, G, and RPatterning.

On the temporary support for a transfer sheet composed of 5 μm thick PETfilm (produced by Teijin Ltd.), sequentially overlapped were a stripedmask (of 50 mm×50 mm, and a thickness of 30 μm, having holes in astriped pattern of a longitudinal length of 970 μm and a lateral lengthof 310 μm and longitudinal and lateral cycles of 990 μm, refer to FIG.22), the organic layer side of the primary transfer sheet for blue, andthe pressing plate (50 mm×50 mm, a longitudinal length of 970 μm and alateral length of 300 μm, a longitudinal and lateral cycle of 990 μm,having projections of a height of 30 μm (refer to FIG. 23)) so that thecenter of the mask hole coincided with the projection of the pressingplate. Subsequently, heat and pressure were applied onto the supportside of the primary transfer sheet via conveyance at a rate of 0.05m/minute between paired rollers exhibiting a pressing pressure of 0.3MPa (one roller being a 160° C. heating roller). Subsequently, bypeeling the pressing plate, the primary transfer sheet, and the maskfrom the temporary support, a blue light emitting layer was transferredonto the transfer sheet (refer to FIG. 17).

Subsequently, the mask, the primary transfer sheet for green, and thepressing plate were overlapped by a shift of one third cycle (330 μm) inthe lateral direction of the pixels so that blue and green pixels werenot overlapped, and the green light emitting layer was transferred ontoa transfer sheet in the same manner as the blue light emitting layer(refer to FIG. 18).

Finally, the mask, the primary transfer sheet for red, and the pressingplate were overlapped by shifting by one third cycle (330 μm) in thelateral direction of the pixels so that blue, green, and red pixels werenot overlapped, and the red light emitting layer was transferred in thesame manner as the green light emitting layer, whereby a transfer sheet,which had been subjected to B, G, and R patterning, was prepared (referto FIG. 19).

(D) Transfer of Light Emitting Organic Layer to Cathode Laminated Body 6

The electron transporting side of Cathode Laminated Body 6 prepared in(A) was overlapped on the light emitting layer side of the transfersheet prepared in (C) which had been subjected to B, G, and R patterningso that light emitting pixels and the striped pattern in thelongitudinal direction of the cathode coincided. Heat and pressure wereapplied onto the rear side of the transfer sheet via conveyance at arate of 0.05 m/minute between paired rollers exhibiting a pressingpressure of 0.3 MPa (one roller being a 160° C. heating roller).Subsequently, by peeling the transfer sheet from the cathode substrate,B, G, and R three-color light emitting layer was transferred ontoCathode Laminated Body 6 (cathode substrate/cathode/electrontransporting layer), prepared in (A), whereby First Laminated Body 6(refer to FIG. 20) was prepared.

(E) Lamination of First Laminated Body 6 with Anode Laminated Body 6

The light emitting layer side of First Laminated Body 6 prepared in (D)was made to face the positive hole transporting layer of Anode LaminatedBody 6 and overlapped so that the striped pattern in the lateraldirection of light emitting pixels coincided with the striped pattern ofthe anode. Subsequently, overlapping was carried out by rotating thelong side direction by 90 degrees as shown in FIG. 21.

Heat and pressure were applied onto the support side of the firstlaminated body 5 via conveyance at a rate of 0.05 m/minute betweenpaired rollers exhibiting a pressing pressure of 0.3 MPa (one rollerbeing a 160° C. heating roller), whereby First Laminated Body 6 andAnode Laminated Body 6 were laminated.

Subsequently, an aluminum lead was extended from each of the lines ofthe anode and the cathode, whereby a 32-pixel×32-pixel passive drivingtype full-color organic EL element, composed of a cathodesubstrate/cathode/electron transporting layer/light emittinglayer/positive hole transporting layer/anode/anode substrate, wasprepared.

(F) Sealing of Side Section

UV curing type epoxy based adhesive agent XNR5493T (produced by NagaseCiba Co., Ltd.) was coated in the adhesive agent position shown in FIG.2 of the organic EL element, prepared as above, to reach a layerthickness of 1 mm, employing a dispenser. After coating, ultravioletradiation at an intensity of 100 mW/cm² was exposed onto both sides ofthe organic EL element, employing a high pressure mercury lamp, toresult in curing, whereby Comparative organic EL Element 6 was prepared.The above sealing was carried out in the globe box in which ambient airwas replaced with nitrogen. The dew point was −60° C., and oxygenconcentration was 10 ppm.

(Preparation of Organic EL Element 7)

Full-color organic EL element 7 composed of a cathodesubstrate/cathode/electron transporting layer/positive hole blockinglayer/light emitting layer/positive hole transporting layer/anode/anodesubstrate was prepared in the same manner as Example 1, except thatorganic layers other than the light emitting layer were prepared viavapor deposition.

(A) Preparation of Cathode Laminated Body 7 (CathodeSubstrate/Cathode/Electron Transporting Layer/Positive Hole BlockingLayer)

Both sides of an Al foil (at a thickness of 30 μm) was laminated with a50 μm thick polyimide sheet (UPILEX 50S, produced by Ube Industries,Ltd.), and the resulting foil was cut to 35 mm×40 mm, whereby a cathodesubstrate was prepared.

The above cathode substrate was placed in a cleaning vessel. Aftercleaning it with i-propyl alcohol (IPA), an oxygen plasma treatment wasapplied. Subsequently, a mask (a mask arranged with stripes of a linewidth of 300 μm and an interval of 30 μm, shown in FIG. 12) fordeposition, which had been subjected to patterning, was arranged, and Alwas vapor-deposited at a reduced pressure of about 0.1 mPa, whereby a0.2 μm thick striped cathode was formed (refer to FIG. 13).

Further, as an electron injecting material, LiF was vapor-deposited inthe same pattern as the Al layer, whereby a 3 nm thick electroninjecting layer was formed.

Subsequently, the above mask was removed, and electron transportingmaterial Alq₃ was vapor-deposited at a reduced pressure ambience ofabout 0.1 mPa to form a 40 nm thick electron transporting layer.Finally, positive hole blocking material BAlq₃ was vapor-deposited at apressure reduced ambience of about 0.1 mPa to form a 10 nm thickpositive hole blocking layer, whereby Cathode Laminated Body 7 wasprepared.

(B) Preparation of Anode Laminated Body 7 (AnodeSubstrate/Anode/Positive Hole Transporting Layer)

A 0.7 mm×35 mm×40 mm glass plate, employed as an anode substrate, wasintroduced into a vacuum chamber, and a mask (a mask arranged withstripes of a line width of 960 μm and an interval of 30 μm, shown inFIG. 14) for deposition, which had been subjected to patterning, wasarranged. Subsequently, employing an ITO target (a mole ratio ofindium:tin of 95:5) containing 10% SnO₂ by weight, a striped anodecomposed of a 0.2 μm thick ITO thin layer was formed via DC magnetronsputtering (conditions: temperature of the substrate support of 250° C.and an oxygen pressure of 1×10⁻³ Pa) (refer to FIG. 15).

The surface conductivity of the above node was 10Ω/□•••••• The anodesubstrate, on which the above anode was formed, was placed in a cleaningvessel and cleaned with isopropyl alcohol, followed by an oxygen plasmatreatment. N,N′-dinaphthyl-N,N′diphenylbendizine (α-NPD) underwentvacuum deposition on the surface of the treated transparent electrode toprepare a 40 nm thick positive hole transporting layer, whereby AnodeLaminated Body B was prepared.

(C) Formation of Light Emitting Organic Layer which was Subjected toPatterning onto Transfer Sheet: Mask Transfer Method(1) Preparation of Primary Transfer Sheet(a) Preparation of Primary Transfer Sheet for Blue

Polyvinyl carbazole (Mw of 63,000, produced by Aldrich Co.), and iridiumcomplex (Ir-12) as an orthometal complex at a weight ratio of 40:1 weredissolved in dichloromethane. The resulting liquid coating compositionwas applied onto a 5 μm thick temporary support composed of a PET film(produced by Teijin Ltd.) via an extrusion type coating apparatus anddried, whereby a 40 nm thick blue light emitting layer was prepared.

(b) Preparation of Primary Transfer Sheet for Green

Polyvinyl carbazole (Mw of 63,000, produced by Aldrich Co.), andtris(2-phenylpyridine)iridium complex (Ir-1) as an orthometal complex ata weight ratio of 40:1 were dissolved in dichloromethane. The resultingliquid coating composition was applied onto a 5 μm thick temporarysupport composed of a PET film (produced by Teijin Ltd.) via anextrusion type coating apparatus and dried, whereby a 40 nm thick greenlight emitting layer was prepared.

(c) Preparation of Red Primary Transfer Sheet

Polyvinyl carbazole (Mw of 63,000, produced by Aldrich Co.), and iridiumcomplex (Ir-9) as an orthometal complex at a weight ratio of 40:1 weredissolved in dichloromethane. The resulting liquid coating compositionwas applied onto a 5 μm thick temporary support composed of a PET film(produced by Teijin Ltd.) via an extrusion type coating apparatus anddried, whereby a 40 nm thick red light emitting layer was prepared.

As described above, three types of primary transfer materials of blue,green, and red light emitting organic layers were prepared on thetemporary support.

(2) Preparation of Transfer Sheet which were Subjected to B, G, and RPatterning.

On the temporary support for a transfer sheet composed of 5 μm thick PETfilm (produced by Teijin Ltd.), sequentially overlapped were a stripedmask (of 50 mm×50 mm, and a thickness of 30 μm, having a holes in astriped pattern of a longitudinal length of 970 μm and a lateral lengthof 310 μm and longitudinal and lateral cycles of 990 μm, refer to FIG.22), the organic layer side of the primary transfer sheet for blue, andthe pressing plate (50 mm×50 mm, a longitudinal length of 970 μm and alateral length of 300 μm, a longitudinal and lateral cycle of 990 μm,having projections of a height of 30 μm (refer to FIG. 23)) so that thecenter of the mask hole coincided with the projection of the pressingplate. Subsequently, heat and pressure were applied onto the supportside of the primary transfer sheet via conveyance at a rate of 0.05m/minute between paired rollers exhibiting a pressing pressure of 0.3MPa (one roller being a 160° C. heating roller). Subsequently, bypeeling the pressing plate, the primary transfer sheet, and the maskfrom the temporary support, a blue light emitting layer was transferredonto the transfer sheet (refer to FIG. 17).

Subsequently, the mask, the primary transfer sheet for green, and thepressing plate were overlapped by a shift of one third cycle (330 μm) inthe lateral direction of the pixels so that blue and green pixels werenot overlapped, and the green light emitting layer was transferred ontoa transfer sheet in the same manner as the blue light emitting layer(refer to FIG. 18).

Finally, the mask, the primary transfer sheet for red, and the pressingplate were overlapped by a shift of one third cycle (330 μm) in thelateral direction of the pixels so that blue, green, and red pixels werenot overlapped, and the red light emitting layer was transferred in thesame manner as the green light emitting layer, whereby a transfer sheet,which had been subjected to B, G, and red patterning, was prepared(refer to FIG. 19).

(D) Transfer of Light Emitting Organic Layer to Cathode Laminated Body 7

The electron transporting side of Cathode Laminated Body 6 prepared in(A) was overlapped on the light emitting layer side of the transfersheet prepared in (C) which had been subjected to B, G, and R patterningso that light emitting pixels and the striped pattern in thelongitudinal direction of the cathode coincided. Heat and pressure wereapplied onto the rear side of the transfer sheet via conveyance at arate of 0.05 m/minute between paired rollers exhibiting a pressingpressure of 0.3 MPa (one roller being a 160° C. heating roller).Subsequently, by peeling the transfer sheet from the cathode substrate,B, G, and R three-color light emitting layer was transferred ontoCathode Laminated Body 7 (cathode substrate/cathode/electrontransporting layer), prepared in (A), whereby First Laminated Body 7(refer to FIG. 20) was prepared.

(E) Lamination of First Laminated Body 7 with Anode Laminated Body 7

The light emitting layer side of First Laminated Body 7 prepared in (D)was made to face the positive hole transporting layer of Anode LaminatedBody 7 and overlapped so that the striped pattern in the lateraldirection of light emitting pixels coincided with the striped pattern ofthe anode. Subsequently, overlapping was carried out by rotating thelong side direction by 90 degrees as shown in FIG. 21.

Heat and pressure were applied onto the support side of First LaminatedBody 7 via conveyance at a rate of 0.05 m/minute between paired rollersexhibiting a pressing pressure of 0.3 MPa (one roller being a 160° C.heating roller), whereby First Laminated Body 7 and Anode Laminated Body7 were laminated.

Subsequently, an aluminum lead was extended from each of the lines ofthe anode and the cathode, whereby a 32-pixel×32-pixel passive drivingtype full-color organic EL element, composed of a cathodesubstrate/cathode/electron transporting layer/light emittinglayer/positive hole transporting layer/anode/anode substrate, wasprepared.

(F) Sealing of Side Section

UV curing type epoxy based adhesive agent XNR5493T (produced by NagaseCiba Co., Ltd.) was coated in the adhesive agent position shown in FIG.2 of the organic EL element, prepared as above, to reach a layerthickness of 1 mm, employing a dispenser. After coating, ultravioletradiation at an intensity of 100 mW/cm² was exposed onto both sides ofthe organic EL element, employing a high pressure mercury lamp, toresult in curing, whereby comparative organic EL element 7 was prepared.Meanwhile, the above sealing was carried out in the globe box in whichambient air was replaced with nitrogen. The dew point was −60° C., andoxygen concentration was 10 ppm.

(Evaluation of Organic EL Elements)

Organic EL elements 1-7, prepared as above, were evaluated via thefollowing methods.

By employing SOURCE MAJOR UNIT TYPE 2400 (produced by Toyo TechnicaInc.), direct current voltage was applied to each of the organic ELelements to achieve light emission. During the above light emission,voltage which resulted in maximum luminance Lmax (cd/m²) was designatedas Vmax(V). Further, luminous efficiency η200(%) was determined at 200cd/m². Further, the lead line extended from each of the electrodes wasconnected to the external driving circuit and the light emitting stateof each pixel was checked, followed by counting poor pixels.

Further, after storing the above organic EL elements at 85° C. and 95%relative humidity for 30 days, Lmax, Vmax, and η200 were determined.Still further, the light emission state of each pixel was checked,followed by counting the number of poor pixels.

Table 1 shows the evaluation results.

TABLE 1 Wet Process Usage Rate of Non-light Poor Pixel Organic ELEmitting Storage Lmax Vmax η200 (number of Element No. Organic LayerDuration (cd/m²) (V) (%) pieces) Remarks 1 100 beginning 48,000 12 13.50 Inv. after 30 days 46,000 12 13.0 0 2 100 beginning 51,000 12 14.0 0Inv. after 30 days 47,000 12 13.5 0 3 100 beginning 52,000 12 14.1 0Inv. after 30 days 48,000 12 13.6 0 4 100 beginning 53,000 12 14.5 0Inv. after 30 days 50,000 12 14.0 0 5 100 beginning 51,000 12 14.1 0Inv. after 30 days 50,000 12 13.7 0 6 71 beginning 55,000 12 14.1 0Comp. after 30 days 42,000 12 12.5 3 7 0 beginning 72,000 12 15.3 0Comp. after 30 days 45,000 20 12.1 7 Inv.: Present Invention, Comp.:Comparative Example

Organic EL Elements 1-5 of the present invention, even though all theprimary transfer materials of the electron transporting layer on thecathode substrate, the positive hole transporting organic layer on theanode substrate, and the light emitting layer on the temporary supportare prepared via wet processes, exhibit performance equal to better thanOrganic EL Elements 6 and 7 of Comparative Examples. According to themethod of the present invention, it is found that by the productionmethod in which wet processes of high production efficiency are mainlyemployed, it is possible to prepare a high performance full-colororganic EL element.

According to the present invention, it is possible to efficientlyproduce organic EL elements at low cost employing wet processes and toeasily prepare elements of a large area. Further, since the organic ELelements of the present invention have a laminated structure,advantages, such as high adhesion between layers, excellent durability,and minimal problems such as dark spots, are realized.

The invention claimed is:
 1. An organic electroluminescent element comprising a laminated body incorporating an anode substrate, an anode, at least one non-light emitting organic layer A exhibiting positive hole transportability, at least one light emitting organic layer B, at least one non-light emitting organic layer C exhibiting electron transportability, a cathode, and a cathode substrate in the sequence set forth, wherein at least 80% by weight of the organic layer A and the organic layer C in the laminated body is formed via a wet process, wherein the laminated body is made with an adhesion process comprising adhering a first partially laminated body comprising the cathode substrate having formed thereon the cathode, the organic layer C, and the organic layer B, in this order, onto a second partially laminated body comprising the anode substrate having formed thereon the anode and the organic layer A, in this order, and wherein light emission from the light emitting organic layer B is phosphorescence emission.
 2. The organic electroluminescent element of claim 1, wherein the organic layer B is formed via a transfer method.
 3. The organic electroluminescent element of claim 1, wherein one of the anode substrate and the cathode substrate is made of a flexible material.
 4. A display device comprising the organic electroluminescent element of claim
 1. 5. A lighting device comprising the organic electroluminescent element of claim
 1. 6. The organic electroluminescent element of claim 1, wherein the organic layer B contains a phosphorescent dopant selected from the group consisting of Ir complexes.
 7. An organic electroluminescent element comprising a laminated body incorporating an anode substrate, an anode, at least one non-light emitting organic layer A exhibiting positive hole transportability, at least one light emitting organic layer B, at least one non-light emitting organic layer C exhibiting electron transportability, a cathode, and a cathode substrate in the sequence set forth, wherein at least 80% by weight of the organic layer A and the organic layer C in the laminated body is formed via a wet process, wherein the laminated body is made with an adhesion process comprising adhering a first partially laminated body comprising the cathode substrate having formed thereon the cathode and the organic layer C, in this order, onto a second partially laminated body comprising the anode substrate having formed thereon the anode, the organic layer A, and the organic layer B, in this order, and wherein light emission from the light emitting organic layer B is phosphorescence emission.
 8. The organic electroluminescent element of claim 7, wherein the organic layer B is formed via a transfer method.
 9. The organic electroluminescent element of claim 7, wherein one of the anode substrate and the cathode substrate is made of a flexible material.
 10. A display device comprising the organic electroluminescent element of claim
 7. 11. A lighting device comprising the organic electroluminescent element of claim
 7. 12. The organic electroluminescent element of claim 7, wherein the organic layer B contains a phosphorescent dopant selected from the group consisting of Ir complexes. 